PCB Service
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Items |
Mass |
Sample |
|
|
Layers |
64L |
100L |
|
|
Max. Board Thickness |
10mm（394mil） |
14mm（551mil） |
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|
Min. Width/Space |
Inner Layer |
2.2mil/2.2mil |
2mil/2mil |
|
Outer Layer |
3mil/3mil |
2.8mil/2.8mil |
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|
Registration |
Same Core |
±30um |
±20um |
|
Layer to Layer |
±5mil |
±4.5mil |
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|
Max. Copper Thickness |
6Oz |
30Oz |
|
|
Min. Drill Hole Diameter |
Mechanical |
0.15mm(6mil) |
0.1mm(4mil) |
|
Laser |
0.1mm(4mil) |
0.075mm(3mil) |
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|
Max. Size (Finish Size) |
Line-card |
850mmX570mm |
1000mmX600mm |
|
Backplane |
1250mmX570mm |
1320mmX600mm |
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Aspect Ratio (Finish Hole) |
Line-card |
16:1 |
20:1 |
|
Backplane |
22:1 |
25:1 |
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Material |
FR4 |
EM827, 370HR, S1000-2, IT180A, EM825, IT158, S1000 / S1155, R1566W, EM285, ,TU862HF |
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|
High Speed |
Megtron6, Megtron4, Megtron7,TU872SLK, FR408HR,,N4000-13 Series |
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High Frequency |
Ro3003, Ro3006, Ro4350B, Ro4360G2, Ro4835, CLTE, Genclad, RF35, FastRise27 |
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Others |
Polyimide, Tk, LCP, BT, C-ply, Fradflex, Omega , ZBC2000, |
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Surface Finish |
HASL, ENIG, Immersion Tin, OSP, Immersion Silver, Electroplating Hard Gold/Soft Gold, Gold Finger, Selective OSP, ENEPIG |
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Mechanical Blind holes Backplane
Layer Count: 68
Board Thickness: 9.5mm
Panel Size: 1370x530mm (54”×21” )
Finished Hole Size: 0.46mm
Aspect Ratio: 20.7:1
Material: Nelco N4000-13EP SI
Application: Data telecom
100 layers dobolue-side Crimping Backplane
Layer: 100
Board Thickness: 14mm
Panel Size: 438mm x 850mm
Minimum Hole Size: 0.34mm
Aspect Ratio: 24.7:1
Material: M7N
Application: backbonetransmission network
Multifunctional integrated Copper Combined board
Layer: 12
Board Thickness: 2.6mm
Copper Thickness: 1oz
Material: Rogers4350BFR4
Type: Metal based power amplifier board
Application: Wireless communication base station
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ODU RF Board
Layer: 10
Board Thickness: 2.0mm
Copper Thickness: 1oz
Material: RO4350FR4
Application: Micro-wave
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E-band ODU RF Board
Layer: 4
Board thickness: 0.7mm
Copper thickness: 1oz
Material: RO4350FR4
Application: Micro-wave
BMS FPC Board
Layer: 1
Board thickness: 0.28mm
Material: Copper coverlay
Type: BMS lug collection board
Application: Car
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FPC Of cars camera
Layer: 6
Board thickness: 1.55mm
Copper thickness: 1oz
Material: MCE-G-700G
Application: Vehicular HD camera
Feature: Rigid-flex
RF Board for automotive collision avoidance radar
Layer: 8
Board thickness: 1.2mm
Copper thickness: 1oz
Material: Ro3000IT180A
Type: 77GHz Millimeter wave radar
Application: automotive collision avoidance radar
FPC for camera
Layer: 6
Board thickness: 0.9mm
Copper thickness: 1 oz
Material: IT180A AK
Application: Vehicular HD camera
Feature: Rigid-flex
Ultrasonic probe FPC Board
Layer: 2 L
Material: PI
Board thickness: 0.09mm
Copper thickness: 6um±1um
Minimum hole size: 50um
Board size: 84mm168mm
Surface finish: Electroplated Soft Gold
Application: Medical care
Feature: Ultrathin Copper , micropore , appearance zero defect FPC
SSD FPC Board
Layer: 14 L
Material: High TG FR4 PI
Board thickness: 1.1mm
Inner layer copper thickness: Hoz
Board size: 121.9mm204.29mm
Surface finish: OSP
Application: Enterprise level SSD
Feature: 4 Level HDI Blind holes combined structure
