| Select |
Mfr Part # |
Price |
Stock ? |
Manufacturer |
Min order |
RoHS status |
Seri |
Package |
Part Status |
Datasheet |
Diameter |
Wire Gauge |
Composition |
Type |
Melting Point |
Form |
Mesh Type |
Process |
Flux Type |
Storage/Refrigeration Temperature |
Shelf Life Start |
Shelf Life |
|
JET551AX30T5
JET PRINTING SOLDER PASTE SN63/P
|
Contact |
- immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
CHIPQUIK® |
Bulk |
Active |
Datasheet
|
- | - | Sn63Pb37 (63/37) | Solder Paste | 361°F (183°C) | Syringe, 3.53 oz (100g) | Leaded | No-Clean | - | Date of Manufacture | 12 Months | - |
|
4915-454G
SOLDER LF SAC305 NO CLEAN
|
Contact |
- immediate |
MG Chemicals |
2 |
ROHS3 Compliant |
4915 |
Spool |
Obsolete |
Datasheet
|
0.040" (1.02mm) | 18 AWG, 19 SWG | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Wire Solder | 423 ~ 430°F (217 ~ 221°C) | Spool, 1 lb (454 g) | Lead Free | No-Clean | 50°F ~ 86°F (10°C ~ 30°C) | Date of Manufacture | 60 Months | - |
|
4916-454G
SOLDER LF SAC305 NO CLEAN
|
Contact |
- immediate |
MG Chemicals |
2 |
ROHS3 Compliant |
4916 |
Spool |
Obsolete |
Datasheet
|
0.050" (1.27mm) | 16 AWG, 18 SWG | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Wire Solder | 423 ~ 430°F (217 ~ 221°C) | Spool, 1 lb (454 g) | Lead Free | No-Clean | 65°F ~ 80°F (18°C ~ 27°C) | - | - | - |
|
4925-454G
SOLDER LF SAC305 RA FLUX
|
Contact |
- immediate |
MG Chemicals |
2 |
ROHS3 Compliant |
4926 |
Spool |
Obsolete |
Datasheet
|
0.032" (0.81mm) | 20 AWG, 21 SWG | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Wire Solder | 423 ~ 430°F (217 ~ 221°C) | Spool, 1 lb (454 g) | Lead Free | Rosin Activated (RA) | 50°F ~ 86°F (10°C ~ 30°C) | Date of Manufacture | 60 Months | - |
|
4926-454G
SOLDER LF SAC305 RA FLUX
|
Contact |
- immediate |
MG Chemicals |
2 |
ROHS3 Compliant |
4926 |
Spool |
Obsolete |
Datasheet
|
0.040" (1.02mm) | 18 AWG, 19 SWG | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Wire Solder | 423 ~ 430°F (217 ~ 221°C) | Spool, 1 lb (454 g) | Lead Free | Rosin Activated (RA) | 65°F ~ 80°F (18°C ~ 27°C) | Date of Manufacture | 60 Months | - |
|
24-6337-7403
SOLDER FLUX-CORED/282 63/37 .062
|
Contact |
- immediate |
Kester Solder |
100 |
unknown |
282 |
Bulk |
Active |
Datasheet
|
0.062" (1.57mm) | 14 AWG, 16 SWG | Sn63Pb37 (63/37) | Wire Solder | 361°F (183°C) | Spool, 1 lb (454 g) | Leaded | Rosin Mildly Activated (RMA) | - | - | - | - |
|
14-7068-0125
SOLDER SOLID WIRE .125" 1LB SPL
|
Contact |
- immediate |
Kester Solder |
100 |
ROHS3 Compliant |
Solid Core Wire |
Bulk |
Active |
Datasheet
|
0.125" (3.18mm) | 8 AWG, 10 SWG | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Wire Solder | 423 ~ 424°F (217 ~ 218°C) | Spool, 1 lb (454 g) | Lead Free | - | 50°F ~ 104°F (10°C ~ 40°C) | - | - | - |
|
92-6040-8860
SOLDER FLUX-CORED/245 .025" 500G
|
Contact |
- immediate |
Kester Solder |
25 |
RoHS non-compliant |
245 |
Bulk |
Active |
Datasheet
|
0.025" (0.64mm) | 30 AWG, 33 SWG | Sn60Pb40 (60/40) | Wire Solder | 361 ~ 374°F (183 ~ 190°C) | Spool, 17.64 oz (500g) | Leaded | No-Clean | 50°F ~ 104°F (10°C ~ 40°C) | - | - | - |
|
SMD291AX500T4C
SOLDER PASTE 63/37 T4 500G
|
Contact |
- immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
- |
Bulk |
Active |
Datasheet
|
- | - | Sn63Pb37 (63/37) | Solder Paste | 361°F (183°C) | Cartridge, 17.64 oz (500g) | 4 | Leaded | No-Clean | 37°F ~ 46°F (3°C ~ 8°C) | Date of Manufacture | 12 Months |
|
SMD4300AX500T4C
SOLDER PASTE 63/37 T4 500G
|
Contact |
- immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
CHIPQUIK® SMD4300 |
Bulk |
Active |
Datasheet
|
- | - | Sn63Pb37 (63/37) | Solder Paste | 361°F (183°C) | Cartridge, 17.64 oz (500g) | 4 | Leaded | No-Clean, Water Soluble | 37°F ~ 46°F (3°C ~ 8°C) | Date of Manufacture | 12 Months |
|
24-7068-1405
SOLDER FLUX-CORED/48 .0240" 1LB
|
Contact |
- immediate |
Kester Solder |
100 |
ROHS3 Compliant |
48 |
Bulk |
Active |
Datasheet
|
0.040" (1.02mm) | 18 AWG, 19 SWG | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Wire Solder | 423 ~ 424°F (217 ~ 218°C) | Spool, 1 lb (454 g) | Lead Free | Rosin Activated (RA) | 50°F ~ 104°F (10°C ~ 40°C) | - | - | - |
|
SMD291AX250T6
SOLDER PASTE IN JAR 250G (T6) SN
|
Contact |
- immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
CHIPQUIK® |
Bulk |
Active |
Datasheet
|
- | - | Sn63Pb37 (63/37) | Solder Paste | 361°F (183°C) | Jar, 8.8 oz (250g) | Leaded | No-Clean | - | Date of Manufacture | 12 Months | - |
|
24-7068-7632
SOLDER FLUX-CORED/275 .093" 1LB
|
Contact |
- immediate |
Kester Solder |
100 |
ROHS3 Compliant |
275 |
Bulk |
Active |
Datasheet
|
0.093" (2.36mm) | 11 AWG, 13 SWG | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Wire Solder | 423 ~ 424°F (217 ~ 218°C) | Spool, 1 lb (454 g) | Lead Free | No-Clean | 50°F ~ 104°F (10°C ~ 40°C) | - | - | - |
|
JET551SNL30T5
JET PRINTING SOLDER PASTE SN96.5
|
Contact |
- immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
CHIPQUIK® |
Bulk |
Active |
Datasheet
|
- | - | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Solder Paste | 423 ~ 428°F (217 ~ 220°C) | Syringe, 3.53 oz (100g) | - | No-Clean | - | Date of Manufacture | 12 Months | - |
|
JET551LT30T5
JET PRINTING SOLDER PASTE SN42/B
|
Contact |
- immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
CHIPQUIK® |
Bulk |
Active |
Datasheet
|
- | - | Sn42Bi57.6Ag0.4 (42/57.6/0.4) | Solder Paste | 280°F (138°C) | Syringe, 3.53 oz (100g) | - | No-Clean | - | Date of Manufacture | 12 Months | - |
