67B6G2007503015R00

Trace-Tec code

51899

Manufacturer

Laird Technologies EMI

Manufacturer Product Number

67B6G2007503015R00

Description

RFI FINGERSTOCK BECU GOLD SOLDER

Datasheet

https://www.laird.com/document/datasheet/67b6g2007503015r00-drawing Datasheet

Product Attributes

Select
Type Description


Categories RFI and EMI - Contacts, Fingerstock and Gaskets
RF and Wireless
Manufacturer Laird Technologies EMI
Series B6G
Package Cut Tape (CT)
Part Status Active
Packaging Cut Tape (CT)
Material Beryllium Copper
Length 0.295" (7.50mm)
Shape -
Type Fingerstock
Width 0.079" (2.00mm)
Operating Temperature -
Height 0.118" (3.00mm)
Attachment Method Solder
Plating Gold
Plating - Thickness -
Similar

Documents and Media

RESOURCE TYPE Link
Datasheet https://www.laird.com/document/datasheet/67b6g2007503015r00-drawing Datasheet
Image -
Video https://www.digikey.com/api/videos/videoplayer/smallplayer/5734635986001 Video

Environmental and Export Classifications

ATTRIBUTE DESCRIPTION
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) Not Applicable
REACH Status Reach unknown
ECCN EAR99
HTSUS 8536.30.8000

Environmental and Export Classifications

ATTRIBUTE DESCRIPTION
Other Names

In stock

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