67SLH060080070PI00
Trace-Tec code
33622
Manufacturer
Laird Technologies EMI
Manufacturer Product Number
67SLH060080070PI00
Description
RFI FILM OVER FOAM PU SOLDER
Datasheet
Datasheet Product Attributes
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|
Type | Description |
|---|---|---|
|
|
Categories |
RFI and EMI - Contacts, Fingerstock and Gaskets RF and Wireless |
|
|
Manufacturer | Laird Technologies EMI |
|
|
Series | SMD Grounding Metallized |
|
|
Package | Tape & Reel (TR) |
| Part Status | Active | |
| Packaging | Tape & Reel (TR) | |
| Material | Polyurethane Foam, Tin-Copper Polyester (SN/CU) | |
| Length | 0.276" (7.00mm) | |
| Shape | Hourglass | |
| Type | Film Over Foam | |
| Width | 0.236" (6.00mm) | |
| Operating Temperature | -40°C ~ 70°C | |
| Height | 0.315" (8.00mm) | |
| Attachment Method | Solder | |
| Plating | - | |
| Plating - Thickness | - |
Datasheet 
Video Environmental and Export Classifications
| ATTRIBUTE | DESCRIPTION |
|---|---|
| RoHS Status | RoHS Compliant |
| Moisture Sensitivity Level (MSL) | Not Applicable |
| REACH Status | Reach unaffected |
| ECCN | EAR99 |
| HTSUS | 8536.90.4000 |
Environmental and Export Classifications
| ATTRIBUTE | DESCRIPTION |
|---|---|
| Other Names |
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