BGA0029-S

Trace-Tec code

40872

Manufacturer

Chip Quik Inc.

Manufacturer Product Number

BGA0029-S

Description

Datasheet

https://www.chipquik.com/datasheets/BGA0029-S.pdf Datasheet

Product Attributes

Select
Type Description


Categories Solder Stencils, Templates
Soldering, Desoldering, Rework Products
Manufacturer Chip Quik Inc.
Series Proto-Advantage BGA
Package Bulk
Part Status Active
Packaging Bulk
Material Stainless Steel
Pitch 0.014" (0.35mm)
Type BGA
Inner Dimension -
Outer Dimension 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad -
Number of Positions 36
Similar

Documents and Media

RESOURCE TYPE Link
Datasheet https://www.chipquik.com/datasheets/BGA0029-S.pdf Datasheet
Image -
Video https://www.digikey.com/api/videos/videoplayer/smallplayer/6228790881001 Video

Environmental and Export Classifications

ATTRIBUTE DESCRIPTION
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) Not Applicable
REACH Status Reach unaffected
ECCN EAR99
HTSUS 8534.00.0040

Environmental and Export Classifications

ATTRIBUTE DESCRIPTION
Other Names

In stock

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