BGA0035-S

Trace-Tec code

11760

Manufacturer

Chip Quik Inc.

Manufacturer Product Number

BGA0035-S

Description

Datasheet

https://www.chipquik.com/datasheets/BGA0035-S.pdf Datasheet

Product Attributes

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Type Description


Categories Solder Stencils, Templates
Soldering, Desoldering, Rework Products
Manufacturer Chip Quik Inc.
Series Proto-Advantage
Package Bulk
Part Status Active
Packaging Bulk
Material Stainless Steel
Pitch 0.020" (0.50mm)
Type BGA
Inner Dimension 0.551" L x 0.551" W (14.00mm x 14.00mm)
Outer Dimension 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad -
Number of Positions 196
Similar

Documents and Media

RESOURCE TYPE Link
Datasheet https://www.chipquik.com/datasheets/BGA0035-S.pdf Datasheet
Image -
Video -

Environmental and Export Classifications

ATTRIBUTE DESCRIPTION
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status Reach unaffected
ECCN EAR99
HTSUS 8515.19.0000

Environmental and Export Classifications

ATTRIBUTE DESCRIPTION
Other Names

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