PA0223-S

Trace-Tec code

52485

Manufacturer

Chip Quik Inc.

Manufacturer Product Number

PA0223-S

Description

Datasheet

https://www.chipquik.com/datasheets/PA0223-S.pdf Datasheet

Product Attributes

Select
Type Description


Categories Solder Stencils, Templates
Soldering, Desoldering, Rework Products
Manufacturer Chip Quik Inc.
Series Proto-Advantage PA
Package Bulk
Part Status Active
Packaging Bulk
Material Stainless Steel
Pitch 0.016" (0.40mm)
Type TQFP
Inner Dimension 0.472" L x 0.472" W (12.00mm x 12.00mm)
Outer Dimension 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad -
Number of Positions 100
Similar

Documents and Media

RESOURCE TYPE Link
Datasheet https://www.chipquik.com/datasheets/PA0223-S.pdf Datasheet
Image -
Video https://www.digikey.com/api/videos/videoplayer/smallplayer/6228790881001 Video

Environmental and Export Classifications

ATTRIBUTE DESCRIPTION
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status Reach unaffected
ECCN EAR99
HTSUS 7218.10.0000

Environmental and Export Classifications

ATTRIBUTE DESCRIPTION
Other Names

Lead time:

Reference price:

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