| Chọn |
Mfr Part # |
Giá |
Stock ? |
Nhà sản xuất |
Số lượng đặt tối thiểu |
RoHS status |
Seri |
Kiểu đóng gói |
Trạng thái sản phẩm |
Tài liệu |
Package / Case |
Speed |
RAM Size |
Operating Temperature |
Core Processor |
Primary Attributes |
Connectivity |
Peripherals |
Supplier Device Package |
Architecture |
Flash Size |
Grade |
Qualification |
|
M2S060TS-1VFG784
M2S060TS-1VFG784
|
Liên hệ |
60 - immediate |
Microchip Technology |
1 |
ROHS3 Compliant |
SmartFusion®2 |
Tray |
Active |
Tài liệu
|
784-FBGA | 166MHz | 64KB | 0°C ~ 85°C (TJ) | ARM® Cortex®-M3 | FPGA - 60K Logic Modules | CANbus, Ethernet, I2C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 784-VFBGA (23x23) | MCU, FPGA | 256KB | - | - |
|
M2S060TS-1VFG784I
M2S060TS-1VFG784I
|
Liên hệ |
60 - immediate |
Microchip Technology |
1 |
ROHS3 Compliant |
SmartFusion®2 |
Tray |
Active |
Tài liệu
|
784-FBGA | 166MHz | 64KB | -40°C ~ 100°C (TJ) | ARM® Cortex®-M3 | FPGA - 60K Logic Modules | CANbus, Ethernet, I2C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 784-VFBGA (23x23) | MCU, FPGA | 256KB | - | - |
|
M2S060T-1FGG484I
IC SOC CORTEX-M3 166MHZ 484FBGA
|
Liên hệ |
50 - immediate |
Microchip Technology |
1 |
ROHS3 Compliant |
SmartFusion®2 |
Tray |
Active |
Tài liệu
|
484-BGA | 166MHz | 64KB | -40°C ~ 100°C (TJ) | ARM® Cortex®-M3 | FPGA - 60K Logic Modules | CANbus, Ethernet, I2C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 484-FPBGA (23x23) | MCU, FPGA | 256KB | - | - |
|
M2S060T-VFG784I
M2S060T-VFG784I
|
Liên hệ |
60 - immediate |
Microchip Technology |
1 |
ROHS3 Compliant |
SmartFusion®2 |
Tray |
Active |
Tài liệu
|
784-FBGA | 166MHz | 64KB | -40°C ~ 100°C (TJ) | ARM® Cortex®-M3 | FPGA - 60K Logic Modules | CANbus, Ethernet, I2C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 784-VFBGA (23x23) | MCU, FPGA | 256KB | - | - |
|
M2S060T-1VFG784
M2S060T-1VFG784
|
Liên hệ |
60 - immediate |
Microchip Technology |
1 |
ROHS3 Compliant |
SmartFusion®2 |
Tray |
Active |
Tài liệu
|
784-FBGA | 166MHz | 64KB | 0°C ~ 85°C (TJ) | ARM® Cortex®-M3 | FPGA - 60K Logic Modules | CANbus, Ethernet, I2C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 784-VFBGA (23x23) | MCU, FPGA | 256KB | - | - |
|
M2S060TS-VFG784
M2S060TS-VFG784
|
Liên hệ |
60 - immediate |
Microchip Technology |
1 |
ROHS3 Compliant |
SmartFusion®2 |
Tray |
Active |
Tài liệu
|
784-FBGA | 166MHz | 64KB | 0°C ~ 85°C (TJ) | ARM® Cortex®-M3 | FPGA - 60K Logic Modules | CANbus, Ethernet, I2C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 784-VFBGA (23x23) | MCU, FPGA | 256KB | - | - |
|
TDA4VL21HGAALZRQ1
AUTOMOTIVE SYSTEM-ON-A-CHIP WITH
|
Liên hệ |
238 - immediate |
Texas Instruments |
1 |
ROHS3 Compliant |
- |
Digi-Reel® |
Active |
Tài liệu
|
770-BFBGA, FCBGA | 2GHz, 1GHz, 1GHz | 1.5MB | -40°C ~ 125°C (TJ) | ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x | - | MCAN, MMC/SD/SDIO, I2C, SPI, UART, USB | DMA, PWM, WDT | 770-FCBGA (23x23) | DSP, MCU, MPU | - | Automotive | AEC-Q100 |
|
XA7Z010-1CLG225Q
IC SOC CORTEX-A9 667MHZ 225BGA
|
Liên hệ |
82 - immediate |
AMD |
1 |
ROHS3 Compliant |
Zynq®-7000 XA |
Tray |
Active |
Tài liệu
|
225-LFBGA, CSPBGA | 667MHz | 256KB | -40°C ~ 125°C (TJ) | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | Artix™-7 FPGA, 28K Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA | 225-CSPBGA (13x13) | MCU, FPGA | - | Automotive | AEC-Q100 |
|
M2S060-1FCSG325I
IC SOC CORTEX-M3 166MHZ 325BGA
|
Liên hệ |
176 - immediate |
Microchip Technology |
1 |
ROHS3 Compliant |
SmartFusion®2 |
Tray |
Active |
Tài liệu
|
325-TFBGA, FCBGA | 166MHz | 64KB | -40°C ~ 100°C (TJ) | ARM® Cortex®-M3 | FPGA - 60K Logic Modules | CANbus, Ethernet, I2C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 325-FCBGA (11x11) | MCU, FPGA | 256KB | - | - |
|
M2S060T-VFG784
M2S060T-VFG784
|
Liên hệ |
60 - immediate |
Microchip Technology |
1 |
ROHS3 Compliant |
SmartFusion®2 |
Tray |
Active |
Tài liệu
|
784-FBGA | 166MHz | 64KB | 0°C ~ 85°C (TJ) | ARM® Cortex®-M3 | FPGA - 60K Logic Modules | CANbus, Ethernet, I2C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 784-VFBGA (23x23) | MCU, FPGA | 256KB | - | - |
|
|
Liên hệ |
630 - immediate |
NXP USA Inc. |
1 |
unknown |
i.MX8ML |
Tray |
Active |
Tài liệu
|
548-LFBGA | 1.8GHz, 800MHz | 868KB | 0°C ~ 95°C (TJ) | ARM® Cortex®-A53, ARM® Cortex®-M7, Hi-Fi4 DSP | - | CANbus, Ethernet, I2C, I2S, PCIe, SD/SDIO, SPI, UART | DMA, PWM, WDT | 548-LFBGA (15x15) | DSP, MCU, MPU | - | - | - |
|
|
Liên hệ |
630 - immediate |
NXP USA Inc. |
1 |
unknown |
i.MX8ML |
Tray |
Active |
Tài liệu
|
548-LFBGA | 1.8GHz, 800MHz | 868KB | 0°C ~ 95°C (TJ) | ARM® Cortex®-A53, ARM® Cortex®-M7, Hi-Fi4 DSP | - | CANbus, Ethernet, I2C, I2S, PCIe, SD/SDIO, SPI, UART | DMA, PWM, WDT | 548-LFBGA (15x15) | DSP, MCU, MPU | - | - | - |
|
TDA4VL21HGAALZRQ1
AUTOMOTIVE SYSTEM-ON-A-CHIP WITH
|
Liên hệ |
- immediate |
Texas Instruments |
250 |
ROHS3 Compliant |
- |
Tape & Reel (TR) |
Active |
Tài liệu
|
770-BFBGA, FCBGA | 2GHz, 1GHz, 1GHz | 1.5MB | -40°C ~ 125°C (TJ) | ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x | - | MCAN, MMC/SD/SDIO, I2C, SPI, UART, USB | DMA, PWM, WDT | 770-FCBGA (23x23) | DSP, MCU, MPU | - | Automotive | AEC-Q100 |
|
TDA4VL21HGAALZRQ1
AUTOMOTIVE SYSTEM-ON-A-CHIP WITH
|
Liên hệ |
238 - immediate |
Texas Instruments |
1 |
ROHS3 Compliant |
- |
Cut Tape (CT) |
Active |
Tài liệu
|
770-BFBGA, FCBGA | 2GHz, 1GHz, 1GHz | 1.5MB | -40°C ~ 125°C (TJ) | ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x | - | MCAN, MMC/SD/SDIO, I2C, SPI, UART, USB | DMA, PWM, WDT | 770-FCBGA (23x23) | DSP, MCU, MPU | - | Automotive | AEC-Q100 |
|
|
Liên hệ |
176 - immediate |
NXP USA Inc. |
1 |
unknown |
- |
Tray |
Active |
Tài liệu
|
- | - | - | - | - | - | - | - | - | - | - | - | - |
