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Mfr Part # |
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Package |
Part Status |
Datasheet |
Package / Case |
Speed |
RAM Size |
Operating Temperature |
Core Processor |
Primary Attributes |
Connectivity |
Peripherals |
Supplier Device Package |
Architecture |
Flash Size |
Grade |
Qualification |
|
XC7Z010-2CLG225I
IC SOC CORTEX-A9 766MHZ 225BGA
|
Contact |
147 - immediate |
AMD |
1 |
ROHS3 Compliant |
Zynq®-7000 |
Tray |
Active |
Datasheet
|
225-LFBGA, CSPBGA | 766MHz | 256KB | -40°C ~ 100°C (TJ) | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | Artix™-7 FPGA, 28K Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA | 225-CSPBGA (13x13) | MCU, FPGA | - | - | - |
|
M2S025-FGG484I
IC SOC CORTEX-M3 166MHZ 484FBGA
|
Contact |
154 - immediate |
Microchip Technology |
1 |
ROHS3 Compliant |
SmartFusion®2 |
Tray |
Active |
Datasheet
|
484-BGA | 166MHz | 64KB | -40°C ~ 100°C (TJ) | ARM® Cortex®-M3 | FPGA - 25K Logic Modules | CANbus, Ethernet, I2C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 484-FPBGA (23x23) | MCU, FPGA | 256KB | - | - |
|
TDA4VE88TGAALZRQ1
AUTOMOTIVE SYSTEM-ON-A-CHIP FOR
|
Contact |
- immediate |
Texas Instruments |
250 |
ROHS3 Compliant |
- |
Tape & Reel (TR) |
Active |
Datasheet
|
770-BFBGA, FCBGA | 2GHz, 1GHz, 1GHz | 2MB | -40°C ~ 125°C (TJ) | ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x | - | MCAN, MMC/SD/SDIO, I2C, SPI, UART, USB | DMA, PWM, WDT | 770-FCBGA (23x23) | DSP, MCU, MPU | - | Automotive | AEC-Q100 |
|
TDA4VE88TGAALZRQ1
AUTOMOTIVE SYSTEM-ON-A-CHIP FOR
|
Contact |
175 - immediate |
Texas Instruments |
1 |
ROHS3 Compliant |
- |
Cut Tape (CT) |
Active |
Datasheet
|
770-BFBGA, FCBGA | 2GHz, 1GHz, 1GHz | 2MB | -40°C ~ 125°C (TJ) | ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x | - | MCAN, MMC/SD/SDIO, I2C, SPI, UART, USB | DMA, PWM, WDT | 770-FCBGA (23x23) | DSP, MCU, MPU | - | Automotive | AEC-Q100 |
|
TDA4VE88TGAALZRQ1
AUTOMOTIVE SYSTEM-ON-A-CHIP FOR
|
Contact |
175 - immediate |
Texas Instruments |
1 |
ROHS3 Compliant |
- |
Digi-Reel® |
Active |
Datasheet
|
770-BFBGA, FCBGA | 2GHz, 1GHz, 1GHz | 2MB | -40°C ~ 125°C (TJ) | ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x | - | MCAN, MMC/SD/SDIO, I2C, SPI, UART, USB | DMA, PWM, WDT | 770-FCBGA (23x23) | DSP, MCU, MPU | - | Automotive | AEC-Q100 |
|
A2F500M3G-FGG484I
IC SOC CORTEX-M3 80MHZ 484FBGA
|
Contact |
1296 - immediate |
Microchip Technology |
1 |
ROHS3 Compliant |
SmartFusion® |
Tray |
Active |
Datasheet
|
484-BGA | 80MHz | 64KB | -40°C ~ 100°C (TJ) | ARM® Cortex®-M3 | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | EBI/EMI, Ethernet, I2C, SPI, UART/USART | DMA, POR, WDT | 484-FPBGA (23x23) | MCU, FPGA | 512KB | - | - |
|
XC7Z010-2CLG400I
IC SOC CORTEX-A9 766MHZ 400BGA
|
Contact |
128 - immediate |
AMD |
1 |
ROHS3 Compliant |
Zynq®-7000 |
Tray |
Active |
Datasheet
|
400-LFBGA, CSPBGA | 766MHz | 256KB | -40°C ~ 100°C (TJ) | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | Artix™-7 FPGA, 28K Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA | 400-CSPBGA (17x17) | MCU, FPGA | - | - | - |