| Select |
Mfr Part # |
Price |
Stock ? |
Manufacturer |
Min order |
RoHS status |
Seri |
Package |
Part Status |
Datasheet |
Diameter |
Wire Gauge |
Composition |
Type |
Melting Point |
Form |
Mesh Type |
Process |
Flux Type |
Storage/Refrigeration Temperature |
Shelf Life Start |
Shelf Life |
|
TS391AX50
THERMALLY STABLE SOLDER PASTE NO
|
Contact |
21 - immediate |
Chip Quik Inc. |
1 |
RoHS non-compliant |
- |
Bulk |
Active |
Datasheet
|
- | - | Sn63Pb37 (63/37) | Solder Paste | 361u00b0F (183u00b0C) | Jar, 1.76 oz (50g) | 4 | Leaded | No-Clean | 68u00b0F ~ 77u00b0F (20u00b0C ~ 25u00b0C) | Date of Manufacture | 12 Months |
|
TS391AX
THERMALLY STABLE SOLDER PASTE NO
|
Contact |
32 - immediate |
Chip Quik Inc. |
1 |
RoHS non-compliant |
- |
Bulk |
Active |
Datasheet
|
- | - | Sn63Pb37 (63/37) | Solder Paste | 361u00b0F (183u00b0C) | Syringe, 0.53 oz (15g), 5cc | 4 | Leaded | No-Clean | 68u00b0F ~ 77u00b0F (20u00b0C ~ 25u00b0C) | Date of Manufacture | 12 Months |
|
TS391LT
THERMALLY STABLE SOLDER PASTE NO
|
Contact |
15 - immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
- |
Bulk |
Active |
Datasheet
|
- | - | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Solder Paste | 281u00b0F (138u00b0C) | Syringe, 0.53 oz (15g), 5cc | 4 | Lead Free | No-Clean | 68u00b0F ~ 77u00b0F (20u00b0C ~ 25u00b0C) | Date of Manufacture | 12 Months |
|
SMDIN97AG3
INDIUM SOLDER WIRE (IN97/AG3) 0.
|
Contact |
55 - immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
SMD |
Bulk |
Active |
Datasheet
|
- | - | - | - | - | - | - | - | - | - | - | - |
|
SMD291AX10
SOLDER PASTE NO-CLEAN 63/37 10CC
|
Contact |
24 - immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
- |
Dispenser |
Active |
Datasheet
|
- | - | Sn63Pb37 (63/37) | Solder Paste | 361u00b0F (183u00b0C) | Syringe, 1.23 oz (35g), 10cc | 3 | Leaded | No-Clean | 37u00b0F ~ 46u00b0F (3u00b0C ~ 8u00b0C) | Date of Manufacture | 12 Months |
|
SMDLTLFP10
SOLDER PASTE LOW TEMP 10CC W/TIP
|
Contact |
35 - immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
- |
Dispenser |
Active |
Datasheet
|
- | - | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Solder Paste | 281u00b0F (138u00b0C) | Syringe, 1.23 oz (35g), 10cc | 3 | Lead Free | No-Clean | 37u00b0F ~ 46u00b0F (3u00b0C ~ 8u00b0C) | Date of Manufacture | 6 Months |
|
T0051403399
WSW SNPB L1, 0,3MM, 100G
|
Contact |
51 - immediate |
Apex Tool Group |
1 |
ROHS3 Compliant |
Weller® |
Spool |
Active |
Datasheet
|
0.012" (0.31mm) | - | Sn60Pb40 (60/40) | Wire Solder | - | Spool, 3.53 oz (100g) | Leaded | No-Clean | - | - | - | - |
|
EXB-SN63PB37
SOLDER BAR SN63/PB37 1LB (454G)
|
Contact |
49 - immediate |
Chip Quik Inc. |
1 |
RoHS non-compliant |
Super Low Dross™ |
Bulk |
Active |
Datasheet
|
- | - | Sn63Pb37 (63/37) | Bar Solder | 361°F (183°C) | Bar, 1 lb (454g) | Leaded | - | - | - | - | - |
|
SMD291SNL10
SOLDER PASTE NO-CLEAN 10CC SYR
|
Contact |
31 - immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
- |
Dispenser |
Active |
Datasheet
|
- | - | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Solder Paste | 423 ~ 428°F (217 ~ 220°C) | Syringe, 1.23 oz (35g), 10cc | 3 | Lead Free | No-Clean | 37°F ~ 46°F (3°C ~ 8°C) | Date of Manufacture | 6 Months |
|
BARSN99.3CU0.7-8OZ
SOLDER BAR SN99.3/CU0.7 8OZ 227G
|
Contact |
33 - immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
Super Low Dross™ |
Bulk |
Active |
Datasheet
|
- | - | Sn99.3Cu0.7 (99.3/0.7) | Bar Solder | 441°F (227°C) | Bar, 0.5 lb (227g) | Lead Free | - | - | - | - | - |
|
SMD4300SNL10
SOLDER PASTE WATER SOL LF 10CC
|
Contact |
11 - immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
CHIPQUIK® SMD4300 |
Dispenser |
Active |
Datasheet
|
- | - | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Solder Paste | 423 ~ 428°F (217 ~ 220°C) | Syringe, 1.23 oz (35g), 10cc | 3 | Lead Free | No-Clean, Water Soluble | 37°F ~ 46°F (3°C ~ 8°C) | Date of Manufacture | 6 Months |
|
TS391LT10
THERMALLY STABLE SOLDER PASTE NO
|
Contact |
27 - immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
- |
Bulk |
Active |
Datasheet
|
- | - | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Solder Paste | 281°F (138°C) | Syringe, 1.23 oz (35g), 10cc | 4 | Lead Free | No-Clean | 68°F ~ 77°F (20°C ~ 25°C) | Date of Manufacture | 12 Months |
|
4902P-25G
LEAD FREE LOW TEMPERATURE SOLDER
|
Contact |
71 - immediate |
MG Chemicals |
1 |
ROHS3 Compliant |
4902 |
Bulk |
Active |
Datasheet
|
- | - | Bi57Sn42Ag1 (57/42/1) | Solder Paste | 281°F (138°C) | Syringe, 0.88 oz (25g) | - | Lead Free | No-Clean | 39°F ~ 50°F (4°C ~ 10°C) | Date of Manufacture | 24 Months |
|
BARSN63PB37
SOLDER BAR SN63/PB37 1LB SUPER L
|
Contact |
89 - immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
Super Low Dross™ |
Bulk |
Active |
Datasheet
|
- | - | Sn63Pb37 (63/37) | Bar Solder | 361°F (183°C) | Bar, 1 lb (454g) | Leaded | - | - | - | - | - |
|
SMD291AX10T5
SOLDER PASTE NO CLEAN T5 10CC
|
Contact |
11 - immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
- |
Dispenser |
Active |
Datasheet
|
- | - | Sn63Pb37 (63/37) | Solder Paste | 361°F (183°C) | Syringe, 1.23 oz (35g), 10cc | 5 | Leaded | No-Clean | 37°F ~ 46°F (3°C ~ 8°C) | Date of Manufacture | 12 Months |
