Select |
Mfr Part # |
Price |
Stock ? |
Manufacturer |
Min order |
RoHS status |
Seri |
Package |
Part Status |
Datasheet |
Diameter |
Wire Gauge |
Composition |
Type |
Melting Point |
Form |
Mesh Type |
Process |
Flux Type |
Storage/Refrigeration Temperature |
Shelf Life Start |
Shelf Life |
|
NC191AX50T5
SMOOTH FLOW LEADED SOLDER PASTE
|
Contact |
23 - immediate |
Chip Quik Inc. |
1 |
RoHS non-compliant |
Smooth Flow™ |
Bulk |
Active |
Datasheet
|
- | - | Sn63Pb37 (63/37) | Solder Paste | 361u00b0F (183u00b0C) | Jar, 1.76 oz (50g) | 5 | Leaded | No-Clean | 37u00b0F ~ 46u00b0F (3u00b0C ~ 8u00b0C) | Date of Manufacture | 12 Months |
|
SMD291AX10T4
SLDR PST NO-CLEAN 63/37 T4 10CC
|
Contact |
14 - immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
- |
Dispenser |
Active |
Datasheet
|
- | - | Sn63Pb37 (63/37) | Solder Paste | 361u00b0F (183u00b0C) | Syringe, 1.23 oz (35g), 10cc | 4 | Leaded | No-Clean | 37u00b0F ~ 46u00b0F (3u00b0C ~ 8u00b0C) | Date of Manufacture | 12 Months |
|
WBNCSAC31-4OZ
LEAD FREE NO-CLEAN FLUX CORE SIL
|
Contact |
19 - immediate |
SRA Soldering Products |
1 |
RoHS non-compliant |
- |
Spool |
Active |
Datasheet
|
- | - | - | - | - | - | - | - | - | - | - | - |
|
WBWSSAC31-4OZ
SOLDER NC SAC305 .031 4 OZ
|
Contact |
15 - immediate |
SRA Soldering Products |
1 |
RoHS non-compliant |
- |
Spool |
Active |
Datasheet
|
- | - | - | - | - | - | - | - | - | - | - | - |
|
SMD2036-25000
SOLDER SPHERES SN96.5/AG3.0/CU0.
|
Contact |
11 - immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
SMD2 |
Bulk |
Active |
Datasheet
|
- | - | - | - | - | - | - | - | - | - | - | - |
|
SMD2SWLT.047 2OZ
SOLDER WIRE SN42/BI57.6/AG0.4 .0
|
Contact |
24 - immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
SMD2 |
Bulk |
Active |
Datasheet
|
- | - | - | - | - | - | - | - | - | - | - | - |
|
SMD2032-25000
SOLDER SPHERES SN96.5/AG3.0/CU0.
|
Contact |
24 - immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
SMD2 |
Bulk |
Active |
Datasheet
|
0.016" (0.40mm) | - | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Solder Sphere | 423 ~ 428°F (217 ~ 220°C) | Jar | Lead Free | - | - | Date of Manufacture | 24 Months | - |
|
SMD3SW.015 100G
SOLDER WIRE 62/36/2 TIN/LEAD/SIL
|
Contact |
17 - immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
SMD3 |
Bulk |
Active |
Datasheet
|
0.015" (0.38mm) | 27 AWG, 28 SWG | Sn62Pb36Ag2 (62/36/2) | Wire Solder | 354°F (179°C) | Spool, 3.53 oz (100g) | Leaded | No-Clean, Water Soluble | - | - | - | - |
|
SMDLTLFP10T4
SOLDER PASTE LOW TEMP T4 10CC
|
Contact |
11 - immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
- |
Dispenser |
Active |
Datasheet
|
- | - | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Solder Paste | 281°F (138°C) | Syringe, 1.23 oz (35g), 10cc | 4 | Lead Free | No-Clean | 37°F ~ 46°F (3°C ~ 8°C) | Date of Manufacture | 6 Months |
|
SMD2028-25000
SOLDER SPHERES SN96.5/AG3.0/CU0.
|
Contact |
7 - immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
SMD2 |
Bulk |
Active |
Datasheet
|
0.014" (0.36mm) | - | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Solder Sphere | 423 ~ 428°F (217 ~ 220°C) | Jar | Lead Free | - | - | Date of Manufacture | 24 Months | - |
|
REM2.7-ULTRA-NL
ULTRA LOW TEMP FLUX CORED CHIP R
|
Contact |
30 - immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
CHIPQUIK® |
Bulk |
Active |
Datasheet
|
- | - | - | - | 144°F (62°C) | - | - | Lead Free | No-Clean, Water Soluble | - | - | - |
|
SMDSWLT.047 2OZ
SOLDER WIRE SN42/BI57/AG1 .047"
|
Contact |
7 - immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
SMD |
Bulk |
Active |
Datasheet
|
0.047" (1.19mm) | - | Bi57Sn42Ag1 (57/42/1) | Wire Solder | 280°F (138°C) | Spool, 2 oz (56.70g) | Lead Free | - | - | - | - | - |
|
SMD4300AX10T4
SLDR PST WATR SOL 63/37 T4 10CC
|
Contact |
28 - immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
CHIPQUIK® SMD4300 |
Dispenser |
Active |
Datasheet
|
- | - | Sn63Pb37 (63/37) | Solder Paste | 361°F (183°C) | Syringe, 1.23 oz (35g), 10cc | 4 | Leaded | No-Clean, Water Soluble | 37°F ~ 46°F (3°C ~ 8°C) | Date of Manufacture | 12 Months |
|
SMD2024-25000
SOLDER SPHERES SN96.5/AG3.0/CU0.
|
Contact |
8 - immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
SMD2 |
Bulk |
Active |
Datasheet
|
0.012" (0.31mm) | - | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Solder Sphere | 423 ~ 428°F (217 ~ 220°C) | Jar | Lead Free | - | - | Date of Manufacture | 24 Months | - |
|
NC2SW.015 4OZ
SOLDER WIRE 60/40 TIN/LEAD (SN60
|
Contact |
13 - immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
CHIPQUIK® |
Bulk |
Active |
Datasheet
|
0.015" (0.38mm) | - | Sn60Pb40 (60/40) | Wire Solder | 361°F ~ 370°F (183°C ~ 188°C) | Spool, 4 oz (113.40g) | Leaded | No-Clean | - | - | - | - |