| Chọn |
Mfr Part # |
Giá |
Stock ? |
Nhà sản xuất |
Số lượng đặt tối thiểu |
RoHS status |
Seri |
Kiểu đóng gói |
Trạng thái sản phẩm |
Tài liệu |
Diameter |
Wire Gauge |
Composition |
Type |
Melting Point |
Form |
Mesh Type |
Process |
Flux Type |
Storage/Refrigeration Temperature |
Shelf Life Start |
Shelf Life |
|
SMD2SWLF.015 .3OZ
LF SOLDER WIRE POCKET PACK 99.3/
|
Liên hệ |
2 - immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
SMD2 |
Bulk |
Active |
Tài liệu
|
0.015" (0.38mm) | 27 AWG, 28 SWG | Sn99.3Cu0.7 (99.3/0.7) | Wire Solder | 441°F (227°C) | Tube, 0.3 oz (8.51g) | Lead Free | No-Clean, Water Soluble | - | - | - | - |
|
RASWLF.015 .3OZ
LF SOLDER WIRE POCKET PACK 96.5/
|
Liên hệ |
5 - immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
- |
Bulk |
Active |
Tài liệu
|
0.015" (0.38mm) | 27 AWG, 28 SWG | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Wire Solder | 422 ~ 428°F (217 ~ 220°C) | Tube, 0.3 oz (8.51g) | Lead Free | Rosin Activated (RA) | - | - | - | - |
|
RASWLF.020 8OZ
LF SOLDER WIRE 96.5/3/0.5 TIN/SI
|
Liên hệ |
1 - immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
- |
Bulk |
Active |
Tài liệu
|
0.020" (0.51mm) | 24 AWG, 25 SWG | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Wire Solder | 422 ~ 428°F (217 ~ 220°C) | Spool, 8 oz (227g), 1/2 lb | Lead Free | Rosin Activated (RA) | - | - | - | - |
|
REM8-ULTRA-NL
ULTRA LOW TEMP FLUX CORED CHIP R
|
Liên hệ |
1 - immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
CHIPQUIK® |
Bulk |
Active |
Tài liệu
|
- | - | - | - | 144°F (62°C) | - | - | Lead Free | No-Clean, Water Soluble | - | - | - |
|
SMD2SWLT.047 8OZ
SOLDER WIRE SN42/BI57.6/AG0.4 .0
|
Liên hệ |
- immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
SMD2 |
Bulk |
Active |
Tài liệu
|
0.047" (1.19mm) | - | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Wire Solder | 280°F (138°C) | Spool, 8 oz (227g), 1/2 lb | Lead Free | - | - | - | - | - |
|
SSLTNC-250G
LOW TEMPERATURE LEAD FREE SOLDER
|
Liên hệ |
- immediate |
SRA Soldering Products |
1 |
RoHS non-compliant |
- |
Bag |
Active |
Tài liệu
|
- | - | Bi57Sn42Ag1 (57/42/1) | Solder Paste | 279°F (137°C) | Jar, 8.8 oz (250g) | 3 | Lead Free | No-Clean | 37°F ~ 46°F (3°C ~ 8°C) | Date of Manufacture | 12 Months |
|
SMD3SWLT.040 50G
SN42/BI58 2.2% FLUX CORE SOLDER
|
Liên hệ |
- immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
SMD3 |
Bulk |
Active |
Tài liệu
|
0.040" (1.02mm) | - | Bi58Sn42 (58/42) | Wire Solder | 280°F (138°C) | Spool, 1.8 oz (50g) | Lead Free | No-Clean, Rosin Activated (RA) | - | - | - | - |
|
SMDAL200
ALUMINUM SOLDER PASTE WATER-SOLU
|
Liên hệ |
- immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
SMD |
Bulk |
Active |
Tài liệu
|
- | - | Sn96.5Ag3.5 (96.5/3.5) | Solder Paste | 430°F (221°C) | Jar, 7.05 oz (200g) | 3 | Lead Free | Water Soluble | 37°F ~ 46°F (3°C ~ 8°C) | Date of Manufacture | 12 Months |
|
T0051387599
WSW SC M1 0,8MM SN0,7CU3,5%
|
Liên hệ |
1 - immediate |
Apex Tool Group |
1 |
unknown |
Weller® |
Spool |
Active |
Tài liệu
|
0.031" (0.79mm) | - | Sn99.3Cu0.7 (99.3/0.7) | Wire Solder | - | Spool, 17.64 oz (500g) | Lead Free | No-Clean | - | - | - | - |
|
SSLTNC-T5-250G
LOW TEMPERATURE LEAD FREE SOLDER
|
Liên hệ |
- immediate |
SRA Soldering Products |
1 |
RoHS non-compliant |
- |
Bag |
Active |
Tài liệu
|
- | - | Bi57Sn42Ag1 (57/42/1) | Solder Paste | 279°F (137°C) | Jar, 8.8 oz (250g) | 5 | Lead Free | No-Clean | 37°F ~ 46°F (3°C ~ 8°C) | Date of Manufacture | 12 Months |
|
SMD2195
SOLDER SPHERES SN63/PB37 .022" (
|
Liên hệ |
1 - immediate |
Chip Quik Inc. |
1 |
RoHS non-compliant |
SMD2 |
Bulk |
Active |
Tài liệu
|
0.022" (0.56mm) | - | Sn63Pb37 (63/37) | Solder Sphere | 361°F (183°C) | Jar | Leaded | - | - | Date of Manufacture | 24 Months | - |
|
T0051387899
WSW SC L0 1,0MM, SN0,7CU3,5%
|
Liên hệ |
1 - immediate |
Apex Tool Group |
1 |
unknown |
Weller® |
Spool |
Active |
Tài liệu
|
0.039" (0.99mm) | - | Sn99.3Cu0.7 (99.3/0.7) | Wire Solder | - | Spool, 17.64 oz (500g) | Lead Free | No-Clean | - | - | - | - |
|
SSLFWS-T5-250G
SOLDER PASTE WATER SOLUBLE SAC30
|
Liên hệ |
1 - immediate |
SRA Soldering Products |
1 |
RoHS non-compliant |
- |
Bag |
Active |
Tài liệu
|
- | - | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Solder Paste | - | Jar, 8.8 oz (250g) | 5 | - | No-Clean, Water Soluble | 37°F ~ 42°F (3°C ~ 6°C) | Date of Manufacture | 12 Months |
|
RASWLF.020 1LB
LF SOLDER WIRE 96.5/3/0.5 TIN/SI
|
Liên hệ |
1 - immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
- |
Bulk |
Active |
Tài liệu
|
0.020" (0.51mm) | 24 AWG, 25 SWG | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Wire Solder | 422 ~ 428°F (217 ~ 220°C) | Spool, 1 lb (454 g) | Lead Free | Rosin Activated (RA) | - | - | - | - |
|
T0051387999
WSW SC L0 0,8MM, SN0,7CU3,5%
|
Liên hệ |
- immediate |
Apex Tool Group |
1 |
unknown |
Weller® |
Spool |
Active |
Tài liệu
|
0.031" (0.79mm) | - | Sn99.3Cu0.7 (99.3/0.7) | Wire Solder | - | Spool, 17.64 oz (500g) | Lead Free | No-Clean | - | - | - | - |
