| Chọn |
Mfr Part # |
Giá |
Stock ? |
Nhà sản xuất |
Số lượng đặt tối thiểu |
RoHS status |
Seri |
Kiểu đóng gói |
Trạng thái sản phẩm |
Tài liệu |
Diameter |
Wire Gauge |
Composition |
Type |
Melting Point |
Form |
Mesh Type |
Process |
Flux Type |
Storage/Refrigeration Temperature |
Shelf Life Start |
Shelf Life |
|
NCSWLF.015 8OZ
LF SOLDER WIRE 96.5/3/0.5 TIN/SI
|
Liên hệ |
25 - immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
CHIPQUIK® |
Bulk |
Active |
Tài liệu
|
0.015" (0.38mm) | - | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Wire Solder | 423 ~ 428°F (217 ~ 220°C) | Spool, 8 oz (226.80g) | - | No-Clean | - | - | - | - |
|
T0051388899
WSW SAC L0 SN3,0AG0,5CU3,5%
|
Liên hệ |
3 - immediate |
Apex Tool Group |
1 |
unknown |
Weller® |
Spool |
Active |
Tài liệu
|
- | - | - | - | - | - | - | - | - | - | - | - |
|
SMDSWLF.015 1LB
LF SOLDER WIRE 96.5/3/0.5 TIN/SI
|
Liên hệ |
7 - immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
- |
Bulk |
Active |
Tài liệu
|
- | - | - | - | - | - | - | - | - | - | - | - |
|
RASWLF.015 1LB
LF SOLDER WIRE 96.5/3/0.5 TIN/SI
|
Liên hệ |
3 - immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
- |
Bulk |
Active |
Tài liệu
|
- | - | - | - | - | - | - | - | - | - | - | - |
|
SMD2170
SOLDER SPHERES SN63/PB37 .014" (
|
Liên hệ |
7 - immediate |
Chip Quik Inc. |
1 |
RoHS non-compliant |
SMD2 |
Bulk |
Active |
Tài liệu
|
- | - | - | - | - | - | - | - | - | - | - | - |
|
4900-227G
SOLDER LF SN96 21GAUGE .5LBS
|
Liên hệ |
16 - immediate |
MG Chemicals |
1 |
ROHS3 Compliant |
4900 |
Spool |
Active |
Tài liệu
|
- | - | - | - | - | - | - | - | - | - | - | - |
|
SMD291SNL50T6
SOLDER PASTE IN JAR 50G (T6) SAC
|
Liên hệ |
7 - immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
SMD |
Bulk |
Active |
Tài liệu
|
- | - | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Solder Paste | 422 ~ 428u00b0F (217 ~ 220u00b0C) | Jar, 1.76 oz (50g) | 6 | Lead Free | No-Clean | 37u00b0F ~ 46u00b0F (3u00b0C ~ 8u00b0C) | Date of Manufacture | 6 Months |
|
WS991AX500T4
SOLDER PASTE THERMALLY STABLE WS
|
Liên hệ |
2 - immediate |
Chip Quik Inc. |
1 |
RoHS non-compliant |
CHIPQUIK® |
Bulk |
Active |
Tài liệu
|
- | - | Sn63Pb37 (63/37) | Solder Paste | 361u00b0F (183u00b0C) | Jar, 17.64 oz (500g) | 4 | Leaded | Water Soluble | Date of Manufacture | 6 Months | - |
|
SMD2150
SOLDER SPHERES SN63/PB37 .010" (
|
Liên hệ |
10 - immediate |
Chip Quik Inc. |
1 |
RoHS non-compliant |
SMD2 |
Bulk |
Active |
Tài liệu
|
- | - | - | - | - | - | - | - | - | - | - | - |
|
SMD4300LTLFP250T4
SOLDER PASTE SN42/BI57.6/AG0.4
|
Liên hệ |
3 - immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
CHIPQUIK® SMD4300 |
Bulk |
Active |
Tài liệu
|
- | - | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Solder Paste | 280u00b0F (138u00b0C) | Jar, 8.8 oz (250g) | Lead Free | No-Clean, Water Soluble | 32u00b0F ~ 77u00b0F (0u00b0C ~ 25u00b0C) | Date of Manufacture | 6 Months | - |
|
TS991SNL500T3
SOLDER PASTE THERMALLY STABLE NC
|
Liên hệ |
4 - immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
CHIPQUIK® |
Bulk |
Active |
Tài liệu
|
- | - | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Solder Paste | 423°F (217°C) | Jar, 17.64 oz (500g) | 3 | Lead Free | No-Clean | Date of Manufacture | 12 Months | - |
|
673832
97SC 400 2% .064DIA 14AWG
|
Liên hệ |
10 - immediate |
Harimatec Inc. |
1 |
ROHS3 Compliant |
C400 |
Bulk |
Active |
Tài liệu
|
0.064" (1.63mm) | 14 AWG, 16 SWG | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Wire Solder | 423°F (217°C) | Spool, 1 lb (454 g) | Lead Free | No-Clean | - | - | - | - |
|
WS991LT500T4
SOLDER PASTE THERMALLY STABLE WS
|
Liên hệ |
3 - immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
CHIPQUIK® |
Bulk |
Active |
Tài liệu
|
- | - | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Solder Paste | 281°F (138°C) | Jar, 17.64 oz (500g) | 4 | Lead Free | Water Soluble | Date of Manufacture | 6 Months | - |
|
673831
97SC 400 2% .048DIA 16AWG
|
Liên hệ |
24 - immediate |
Harimatec Inc. |
1 |
ROHS3 Compliant |
C400 |
Bulk |
Active |
Tài liệu
|
0.048" (1.22mm) | 16 AWG, 18 SWG | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Wire Solder | 423°F (217°C) | Spool, 1 lb (454 g) | Lead Free | No-Clean | 59°F ~ 86°F (15°C ~ 30°C) | - | - | - |
|
SMD3SWLT.040 100G
SN42/BI58 2.2% FLUX CORE SOLDER
|
Liên hệ |
9 - immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
SMD3 |
Bulk |
Active |
Tài liệu
|
0.040" (1.02mm) | - | Bi58Sn42 (58/42) | Wire Solder | 280°F (138°C) | Spool, 3.53 oz (100g) | Lead Free | No-Clean, Rosin Activated (RA) | - | - | - | - |
