1844641
Trace-Tec code
499749
Manufacturer
Harimatec Inc.
Manufacturer Product Number
1844641
Description
Lead Free No-Clean Solder Paste SnAg3.8Cu0.7Bi3Sb1.4Ni0.15 Jar, 17.64 oz (500g)
Product Attributes
|
|
Type | Description |
|---|---|---|
|
|
Categories |
Solder Soldering, Desoldering, Rework Products |
|
|
Manufacturer | Harimatec Inc. |
|
|
Series | HF212 |
|
|
Package | Bulk |
| Part Status | Obsolete | |
| Packaging | Bulk | |
| Diameter | - | |
| Wire Gauge | - | |
| Composition | SnAg3.8Cu0.7Bi3Sb1.4Ni0.15 | |
| Type | Solder Paste | |
| Melting Point | 408 ~ 424°F (209 ~ 218°C) | |
| Form | Jar, 17.64 oz (500g) | |
| Mesh Type | - | |
| Process | Lead Free | |
| Flux Type | No-Clean | |
| Storage/Refrigeration Temperature | - | |
| Shelf Life Start | Date of Manufacture | |
| Shelf Life | 6 Months |
Documents and Media
| RESOURCE TYPE | Link |
|---|---|
| Datasheet |
Datasheet
|
| Image | - |
| Video | - |
Environmental and Export Classifications
| ATTRIBUTE | DESCRIPTION |
|---|---|
| RoHS Status | Request Inventory Verification |
| Moisture Sensitivity Level (MSL) | Not Applicable |
| REACH Status | REACH Unknown |
| ECCN | EAR99 |
| HTSUS | 8311.90.0000 |
Environmental and Export Classifications
| ATTRIBUTE | DESCRIPTION |
|---|---|
| Other Names |
Similar Products
