SMDSWLF.031 2OZ
Trace-Tec code
11705
Manufacturer
Chip Quik Inc.
Manufacturer Product Number
SMDSWLF.031 2OZ
Description
Lead Free No-Clean, Water Soluble Wire Solder Sn96.5Ag3Cu0.5 (96.5/3/0.5) 20 AWG, 22 SWG Spool, 2 oz (56.70g)
Datasheet
Datasheet Product Attributes
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Type | Description |
|---|---|---|
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Categories |
Solder Soldering, Desoldering, Rework Products |
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Manufacturer | Chip Quik Inc. |
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Series | - |
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Package | Spool |
| Part Status | Active | |
| Packaging | Spool | |
| Diameter | 0.031" (0.79mm) | |
| Wire Gauge | 20 AWG, 22 SWG | |
| Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | |
| Type | Wire Solder | |
| Melting Point | 423 ~ 428u00b0F (217 ~ 220u00b0C) | |
| Form | Spool, 2 oz (56.70g) | |
| Process | Lead Free | |
| Flux Type | No-Clean, Water Soluble | |
| Storage/Refrigeration Temperature | - | |
| Shelf Life Start | - | |
| Shelf Life | - |
Documents and Media
| RESOURCE TYPE | Link |
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| Datasheet |
Datasheet
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| Image | - |
| Video | - |
Environmental and Export Classifications
| ATTRIBUTE | DESCRIPTION |
|---|---|
| RoHS Status | ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| REACH Status | Reach unaffected |
| ECCN | EAR99 |
| HTSUS | 8311.30.3000 |
Environmental and Export Classifications
| ATTRIBUTE | DESCRIPTION |
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| Other Names |
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