JET551SNL10T5
Trace-Tec code
365186
Manufacturer
Chip Quik Inc.
Manufacturer Product Number
JET551SNL10T5
Description
No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Syringe, 1.23 oz (35g), 10cc
Datasheet
Datasheet Product Attributes
|
|
Type | Description |
|---|---|---|
|
|
Categories |
Solder Soldering, Desoldering, Rework Products |
|
|
Manufacturer | Chip Quik Inc. |
|
|
Series | CHIPQUIK® |
|
|
Package | Bulk |
| Part Status | Active | |
| Packaging | Bulk | |
| Diameter | - | |
| Wire Gauge | - | |
| Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | |
| Type | Solder Paste | |
| Melting Point | 423 ~ 428u00b0F (217 ~ 220u00b0C) | |
| Form | Syringe, 1.23 oz (35g), 10cc | |
| Process | - | |
| Flux Type | No-Clean | |
| Storage/Refrigeration Temperature | - | |
| Shelf Life Start | Date of Manufacture | |
| Shelf Life | 12 Months |
Documents and Media
| RESOURCE TYPE | Link |
|---|---|
| Datasheet |
Datasheet
|
| Image | - |
| Video | - |
Environmental and Export Classifications
| ATTRIBUTE | DESCRIPTION |
|---|---|
| RoHS Status | ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| REACH Status | Reach unaffected |
| ECCN | EAR99 |
| HTSUS | 3810.10.0000 |
Environmental and Export Classifications
| ATTRIBUTE | DESCRIPTION |
|---|---|
| Other Names |
Similar Products
