JET551SNL30T5
Trace-Tec code
381029
Manufacturer
Chip Quik Inc.
Manufacturer Product Number
JET551SNL30T5
Description
No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Syringe, 3.53 oz (100g)
Datasheet
Datasheet Product Attributes
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Type | Description |
|---|---|---|
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Categories |
Solder Soldering, Desoldering, Rework Products |
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Manufacturer | Chip Quik Inc. |
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Series | CHIPQUIK® |
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Package | Bulk |
| Part Status | Active | |
| Packaging | Bulk | |
| Diameter | - | |
| Wire Gauge | - | |
| Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | |
| Type | Solder Paste | |
| Melting Point | 423 ~ 428°F (217 ~ 220°C) | |
| Form | Syringe, 3.53 oz (100g) | |
| Process | - | |
| Flux Type | No-Clean | |
| Storage/Refrigeration Temperature | - | |
| Shelf Life Start | Date of Manufacture | |
| Shelf Life | 12 Months |
Documents and Media
| RESOURCE TYPE | Link |
|---|---|
| Datasheet |
Datasheet
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| Image | - |
| Video | - |
Environmental and Export Classifications
| ATTRIBUTE | DESCRIPTION |
|---|---|
| RoHS Status | ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| REACH Status | Reach unaffected |
| ECCN | |
| HTSUS |
Environmental and Export Classifications
| ATTRIBUTE | DESCRIPTION |
|---|---|
| Other Names |
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