SMD291AX500T5
Trace-Tec code
415803
Manufacturer
Chip Quik Inc.
Manufacturer Product Number
SMD291AX500T5
Description
Leaded No-Clean Solder Paste Sn63Pb37 (63/37) Jar, 17.64 oz (500g)
Datasheet
Datasheet Product Attributes
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Type | Description |
|---|---|---|
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Categories |
Solder Soldering, Desoldering, Rework Products |
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Manufacturer | Chip Quik Inc. |
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Series | - |
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Package | Bulk |
| Part Status | Active | |
| Packaging | Bulk | |
| Diameter | - | |
| Wire Gauge | - | |
| Composition | Sn63Pb37 (63/37) | |
| Type | Solder Paste | |
| Melting Point | 361°F (183°C) | |
| Form | Jar, 17.64 oz (500g) | |
| Mesh Type | 5 | |
| Process | Leaded | |
| Flux Type | No-Clean | |
| Storage/Refrigeration Temperature | 37°F ~ 46°F (3°C ~ 8°C) | |
| Shelf Life Start | Date of Manufacture | |
| Shelf Life | 12 Months |
Documents and Media
| RESOURCE TYPE | Link |
|---|---|
| Datasheet |
Datasheet
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| Image | - |
| Video | - |
Environmental and Export Classifications
| ATTRIBUTE | DESCRIPTION |
|---|---|
| RoHS Status | ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) | Not Applicable |
| REACH Status | Reach unaffected |
| ECCN | EAR99 |
| HTSUS | 3810.10.0000 |
Environmental and Export Classifications
| ATTRIBUTE | DESCRIPTION |
|---|---|
| Other Names |
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