SMDLTLFP250T3
Trace-Tec code
121315
Manufacturer
Chip Quik Inc.
Manufacturer Product Number
SMDLTLFP250T3
Description
Lead Free No-Clean Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) Jar, 8.8 oz (250g)
Datasheet
Datasheet Product Attributes
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Type | Description |
|---|---|---|
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Categories |
Solder Soldering, Desoldering, Rework Products |
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Manufacturer | Chip Quik Inc. |
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Series | - |
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Package | Bulk |
| Part Status | Active | |
| Packaging | Bulk | |
| Diameter | - | |
| Wire Gauge | - | |
| Composition | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | |
| Type | Solder Paste | |
| Melting Point | 281°F (138°C) | |
| Form | Jar, 8.8 oz (250g) | |
| Mesh Type | 3 | |
| Process | Lead Free | |
| Flux Type | No-Clean | |
| Storage/Refrigeration Temperature | 37°F ~ 46°F (3°C ~ 8°C) | |
| Shelf Life Start | Date of Manufacture | |
| Shelf Life | 6 Months |
Documents and Media
| RESOURCE TYPE | Link |
|---|---|
| Datasheet |
Datasheet
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| Image | - |
| Video | - |
Environmental and Export Classifications
| ATTRIBUTE | DESCRIPTION |
|---|---|
| RoHS Status | ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) | Not Applicable |
| REACH Status | Reach unaffected |
| ECCN | EAR99 |
| HTSUS | 8311.30.6000 |
Environmental and Export Classifications
| ATTRIBUTE | DESCRIPTION |
|---|---|
| Other Names |
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