Select |
Mfr Part # |
Price |
Stock ? |
Manufacturer |
Min order |
RoHS status |
Seri |
Package |
Part Status |
Datasheet |
Package / Case |
Speed |
RAM Size |
Operating Temperature |
Core Processor |
Primary Attributes |
Connectivity |
Peripherals |
Supplier Device Package |
Architecture |
Flash Size |
Grade |
Qualification |
|
QCC-743-1-MQFN40-TR-00-0
QCC-743-1-MQFN40-TR-00-0.
|
Contact |
- immediate |
Qualcomm |
4000 |
ROHS3 Compliant |
Qualcomm® QCC740 |
Tape & Reel (TR) |
Active |
Datasheet
|
40-VFQFN | 325MHz | 484KB | -40°C ~ 105°C | RISC-V | - | CANbus, I2C, SDIO, SPI, UART/USART | I2S, PWM | 40-QFN (5x5) | DSP, MCU | 128KB | - | - |
|
BCM58101LB0KFBG
LYNX - 100MHZ
|
Contact |
- immediate |
Broadcom Limited |
1009 |
ROHS3 Compliant |
* |
Bulk |
Obsolete |
Datasheet
|
- | - | - | - | - | - | - | - | - | - | - | - | - |
|
BCM60321KMLG
BCM60321: 200MBPS POWERLINE
|
Contact |
- immediate |
Broadcom Limited |
0 |
ROHS3 Compliant |
* |
Tray |
Active |
Datasheet
|
- | - | - | - | - | - | - | - | - | - | - | - | - |
|
QCC-744-2-MQFN56-TR-00-0
QCC-744-2-MQFN56-TR-00-0.
|
Contact |
- immediate |
Qualcomm |
2000 |
ROHS3 Compliant |
Qualcomm® QCC740 |
Tape & Reel (TR) |
Active |
Datasheet
|
56-VFQFN | 325MHz | 484KB | -40°C ~ 105°C | RISC-V | - | CANbus, I2C, SDIO, SPI, UART/USART | I2S, PWM | 56-QFN (7x7) | DSP, MCU | 128KB | - | - |
|
QCC-744-2-MQFN56-MT-00-0
QCC-744-2-MQFN56-MT-00-0.
|
Contact |
- immediate |
Qualcomm |
2600 |
ROHS3 Compliant |
Qualcomm® QCC740 |
Tray |
Active |
Datasheet
|
56-VFQFN | 325MHz | 484KB | -40°C ~ 105°C | RISC-V | - | CANbus, I2C, SDIO, SPI, UART/USART | I2S, PWM | 56-QFN (7x7) | DSP, MCU | 128KB | - | - |
|
MAX32655GXG+T
M4 CORE 100MHZ, 512KB/128KB, NO
|
Contact |
- immediate |
Analog Devices Inc./Maxim Integrated |
2500 |
ROHS3 Compliant |
DARWIN |
Tape & Reel (TR) |
Active |
Datasheet
|
81-LFBGA | 100MHz | 128kB | -40°C ~ 105°C (TA) | ARM® Cortex®-M4F | - | Bluetooth, I2C, SPI, UART | DMA, I2S, PWM, WDT | 81-CTBGA (8x8) | MCU | 512KB | - | - |
|
|
Contact |
- immediate |
Broadcom Limited |
561 |
ROHS3 Compliant |
* |
Bulk |
Active |
Datasheet
|
- | - | - | - | - | - | - | - | - | - | - | - | - |
|
XCZU2EG-1UBVA530I
IC SOC CORTEX-A53 530BGA
|
Contact |
0 - immediate |
AMD |
1 |
ROHS3 Compliant |
- |
Tray |
Active |
Datasheet
|
530-WFBGA, FCBGA | 500MHz, 1.2GHz | 256KB | -40u00b0C ~ 100u00b0C (TJ) | Quad ARMu00ae Cortexu00ae-A53 MPCoreu2122 with CoreSightu2122, Dual ARMu00aeCortexu2122-R5 with CoreSightu2122 | Zynqu00aeUltraScale+u2122 FPGA, 103K+ Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 530-FCBGA (16x9.5) | MPU, FPGA | - | - | - |
|
XCVM1302-1LSENSVF1369
IC VERSALPRIME ACAP FPGA 1369BGA
|
Contact |
5 - immediate |
AMD |
1 |
ROHS3 Compliant |
Versal™ Prime |
Tray |
Active |
Datasheet
|
1369-BFBGA | 600MHz, 1.3GHz | 256KB | 0°C ~ 100°C (TJ) | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | Versal™ Prime FPGA, 70k Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | 1369-BGA (35x35) | MPU, FPGA | - | - | - |
|
XCVM1302-2HSINBVB1024
IC VERSALPRIME ACAP FPGA 1024BGA
|
Contact |
5 - immediate |
AMD |
1 |
ROHS3 Compliant |
Versal™ Prime |
Tray |
Active |
Datasheet
|
1024-BFBGA | 600MHz, 1.4GHz | 256KB | -40°C ~ 100°C (TJ) | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | Versal™ Prime FPGA, 70k Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | 1024-BGA (31x31) | MPU, FPGA | - | - | - |
|
XCZU17EG-2FFVC1760E
IC SOC CORTEX-A53 1760FCBGA
|
Contact |
8 - immediate |
AMD |
1 |
ROHS3 Compliant |
Zynq® UltraScale+™ MPSoC EG |
Tray |
Active |
Datasheet
|
1760-BBGA, FCBGA | 533MHz, 600MHz, 1.3GHz | 256KB | 0°C ~ 100°C (TJ) | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 1760-FCBGA (42.5x42.5) | MCU, FPGA | - | - | - |
|
XCVM1402-2LSEVFVC1596
IC VERSALPRIME ACAP FPGA 1596BGA
|
Contact |
2 - immediate |
AMD |
1 |
ROHS3 Compliant |
Versal™ Prime |
Tray |
Active |
Datasheet
|
1596-BFBGA | 600MHz, 1.4GHz | 256KB | 0°C ~ 100°C (TJ) | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | Versal™ Prime FPGA, 1.2M Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | 1596-BGA (37.5x37.5) | MPU, FPGA | - | - | - |
|
XCVM1402-2MLIVSVD1760
IC VERSALPRIME ACAP FPGA 1760BGA
|
Contact |
2 - immediate |
AMD |
1 |
ROHS3 Compliant |
Versal™ Prime |
Tray |
Active |
Datasheet
|
1760-BFBGA, FCBGA | 600MHz, 1.4GHz | 256KB | -40°C ~ 100°C (TJ) | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | Versal™ Prime FPGA, 1.2M Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | 1760-FCBGA (40x40) | MPU, FPGA | - | - | - |
|
XCZU5EG-L2SFVC784E
IC SOC CORTEX-A53 784FCBGA
|
Contact |
2 - immediate |
AMD |
1 |
ROHS3 Compliant |
Zynq® UltraScale+™ MPSoC EG |
Tray |
Active |
Datasheet
|
784-BFBGA, FCBGA | 533MHz, 600MHz, 1.3GHz | 256KB | 0°C ~ 100°C (TJ) | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 784-FCBGA (23x23) | MCU, FPGA | - | - | - |
|
A2F200M3F-FGG256I
IC SOC CORTEX-M3 80MHZ 256FBGA
|
Contact |
- immediate |
Microchip Technology |
1 |
ROHS3 Compliant |
SmartFusion® |
Tray |
Active |
Datasheet
|
256-LBGA | 80MHz | 64KB | -40°C ~ 100°C (TJ) | ARM® Cortex®-M3 | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | EBI/EMI, Ethernet, I2C, SPI, UART/USART | DMA, POR, WDT | 256-FPBGA (17x17) | MCU, FPGA | 256KB | - | - |