| Chọn |
Mfr Part # |
Giá |
Stock ? |
Nhà sản xuất |
Số lượng đặt tối thiểu |
RoHS status |
Seri |
Kiểu đóng gói |
Trạng thái sản phẩm |
Tài liệu |
Diameter |
Wire Gauge |
Composition |
Type |
Melting Point |
Form |
Mesh Type |
Process |
Flux Type |
Storage/Refrigeration Temperature |
Shelf Life Start |
Shelf Life |
|
389261
60/40 370 3% .015DIA 27AWG
|
Liên hệ |
17 - immediate |
Harimatec Inc. |
1 |
RoHS non-compliant |
370 |
Bulk |
Active |
Tài liệu
|
0.015" (0.38mm) | 27 AWG, 28 SWG | Sn60Pb40 (60/40) | Wire Solder | 361 ~ 374°F (183 ~ 190°C) | Spool, 8.8 oz (250g) | Leaded | Rosin Activated (RA) | - | - | - | - |
|
NC2SWLF.031 1LB
LF SOLDER WIRE 99.3/0.7 TIN/COPP
|
Liên hệ |
13 - immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
- |
Bulk |
Active |
Tài liệu
|
0.031" (0.79mm) | 20 AWG, 21 SWG | Sn99.3Cu0.7 (99.3/0.7) | Wire Solder | 441°F (227°C) | Spool, 1 lb (454 g) | Lead Free | No-Clean | - | - | - | - |
|
24-6040-9721
SOLDER FLUX-CORED/285 .062" 1LB
|
Liên hệ |
17 - immediate |
Kester Solder |
1 |
RoHS non-compliant |
285 |
Bulk |
Active |
Tài liệu
|
0.062" (1.57mm) | 14 AWG, 16 SWG | Sn60Pb40 (60/40) | Wire Solder | 361 ~ 374°F (183 ~ 190°C) | Spool, 1 lb (454 g) | Leaded | Rosin Mildly Activated (RMA) | 50°F ~ 104°F (10°C ~ 40°C) | Date of Manufacture | 36 Months | - |
|
14-6337-0062
SOLDER SOLID WIRE 14AWG 63/37
|
Liên hệ |
3 - immediate |
Kester Solder |
1 |
RoHS non-compliant |
Solid Core Wire |
Spool |
Active |
Tài liệu
|
0.062" (1.57mm) | 14 AWG, 16 SWG | Sn63Pb37 (63/37) | Wire Solder | 361°F (183°C) | Spool, 1 lb (454 g) | Leaded | - | 50°F ~ 104°F (10°C ~ 40°C) | Date of Manufacture | 36 Months | - |
|
SMD291SNL250T4
SLDR PST NO-CLEAN SAC305 T4 250G
|
Liên hệ |
9 - immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
- |
Bulk |
Active |
Tài liệu
|
- | - | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Solder Paste | 423 ~ 428°F (217 ~ 220°C) | Jar, 8.8 oz (250g) | 4 | Lead Free | No-Clean | 37°F ~ 46°F (3°C ~ 8°C) | Date of Manufacture | 6 Months |
|
SMD4300SNL250T4
SLDR PST WATR SOL SAC305 T4 250G
|
Liên hệ |
12 - immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
CHIPQUIK® SMD4300 |
Bulk |
Active |
Tài liệu
|
- | - | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Solder Paste | 423 ~ 428°F (217 ~ 220°C) | Jar, 8.8 oz (250g) | 4 | Lead Free | No-Clean, Water Soluble | 37°F ~ 46°F (3°C ~ 8°C) | Date of Manufacture | 6 Months |
|
TS391SNL250
THERMALLY STABLE SOLDER PASTE NO
|
Liên hệ |
13 - immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
- |
Bulk |
Active |
Tài liệu
|
- | - | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Solder Paste | 423 ~ 428°F (217 ~ 220°C) | Jar, 8.8 oz (250g) | 4 | Lead Free | No-Clean | 68°F ~ 77°F (20°C ~ 25°C) | Date of Manufacture | 12 Months |
|
SMDLTLFP250T3
SOLDER PASTE SN42/BI58 250G
|
Liên hệ |
5 - immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
- |
Bulk |
Active |
Tài liệu
|
- | - | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Solder Paste | 281°F (138°C) | Jar, 8.8 oz (250g) | 3 | Lead Free | No-Clean | 37°F ~ 46°F (3°C ~ 8°C) | Date of Manufacture | 6 Months |
|
24-6040-0010
SOLDER RA 60/40 24AWG 1LB
|
Liên hệ |
15 - immediate |
Kester Solder |
1 |
RoHS non-compliant |
44 |
Spool |
Active |
Tài liệu
|
0.020" (0.51mm) | 24 AWG, 25 SWG | Sn60Pb40 (60/40) | Wire Solder | 361 ~ 374°F (183 ~ 190°C) | Spool, 1 lb (454 g) | Leaded | Rosin Activated (RA) | 50°F ~ 104°F (10°C ~ 40°C) | Date of Manufacture | 36 Months | - |
|
SMDSWLF.006 50G
LF SOLDER WIRE 96.5/3/0.5 TIN/SI
|
Liên hệ |
25 - immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
SMD |
Bulk |
Active |
Tài liệu
|
- | - | - | - | - | - | - | - | - | - | - | - |
|
SMDLTLFP250T4
SOLDER PASTE LOW TEMP T4 250G
|
Liên hệ |
5 - immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
- |
Bulk |
Active |
Tài liệu
|
- | - | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Solder Paste | 281u00b0F (138u00b0C) | Jar, 8.8 oz (250g) | 4 | Lead Free | No-Clean | 37u00b0F ~ 46u00b0F (3u00b0C ~ 8u00b0C) | Date of Manufacture | 6 Months |
|
TS391LT250
THERMALLY STABLE SOLDER PASTE NO
|
Liên hệ |
3 - immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
- |
Bulk |
Active |
Tài liệu
|
- | - | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Solder Paste | 281u00b0F (138u00b0C) | Jar, 8.8 oz (250g) | 4 | Lead Free | No-Clean | 68u00b0F ~ 77u00b0F (20u00b0C ~ 25u00b0C) | Date of Manufacture | 12 Months |
|
SMD291AX250T5
SOLDER PASTE SN63/PB37 250G T5
|
Liên hệ |
7 - immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
- |
Bulk |
Active |
Tài liệu
|
- | - | Sn63Pb37 (63/37) | Solder Paste | 361u00b0F (183u00b0C) | Jar, 8.8 oz (250g) | 5 | Leaded | No-Clean | 37u00b0F ~ 46u00b0F (3u00b0C ~ 8u00b0C) | Date of Manufacture | 12 Months |
|
TS991SNL500T4
SOLDER PASTE THERMALLY STABLE NC
|
Liên hệ |
2 - immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
CHIPQUIK® |
Bulk |
Active |
Tài liệu
|
- | - | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Solder Paste | 423u00b0F (217u00b0C) | Jar, 17.64 oz (500g) | 4 | Lead Free | No-Clean | Date of Manufacture | 12 Months | - |
|
96-9574-9531
K100LD 3.3%/268 .031 500 G ROBO
|
Liên hệ |
21 - immediate |
Kester Solder |
1 |
ROHS3 Compliant |
268 |
Bulk |
Active |
Tài liệu
|
- | - | - | - | - | - | - | - | - | - | - | - |
