| Chọn |
Mfr Part # |
Giá |
Stock ? |
Nhà sản xuất |
Số lượng đặt tối thiểu |
RoHS status |
Seri |
Kiểu đóng gói |
Trạng thái sản phẩm |
Tài liệu |
Diameter |
Wire Gauge |
Composition |
Type |
Melting Point |
Form |
Mesh Type |
Process |
Flux Type |
Storage/Refrigeration Temperature |
Shelf Life Start |
Shelf Life |
|
4884-227G
SOLDER RA 63/37 .025" 1/2 LBS
|
Liên hệ |
15 - immediate |
MG Chemicals |
1 |
RoHS non-compliant |
4880 |
Spool |
Active |
Tài liệu
|
0.025" (0.64mm) | 22 AWG, 23 SWG | Sn63Pb37 (63/37) | Wire Solder | 361°F (183°C) | Spool, 8 oz (227g), 1/2 lb | Leaded | Rosin Activated (RA) | 50°F ~ 86°F (10°C ~ 30°C) | Date of Manufacture | 60 Months | - |
|
WBRA633720-1LB
SOLDER ROSIN 63/37 .020 1 LB
|
Liên hệ |
7 - immediate |
SRA Soldering Products |
1 |
RoHS non-compliant |
- |
Spool |
Active |
Tài liệu
|
0.020" (0.51mm) | - | Sn63Pb37 (63/37) | Wire Solder | 361°F (183°C) | Spool, 16 oz (453.592g) | Leaded | Rosin Activated (RA) | - | Date of Manufacture | 24 Months | - |
|
SMD4300AX250T4
SLDR PST WATR SOL 63/37 T4 250G
|
Liên hệ |
23 - immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
CHIPQUIK® SMD4300 |
Bulk |
Active |
Tài liệu
|
- | - | Sn63Pb37 (63/37) | Solder Paste | 361°F (183°C) | Jar, 8.8 oz (250g) | 4 | Leaded | No-Clean, Water Soluble | 37°F ~ 46°F (3°C ~ 8°C) | Date of Manufacture | 12 Months |
|
386832
60/40 370 3% .064DIA. 14AWG
|
Liên hệ |
13 - immediate |
Harimatec Inc. |
1 |
ROHS3 Compliant |
370 |
Bulk |
Active |
Tài liệu
|
0.064" (1.63mm) | 14 AWG, 16 SWG | Sn60Pb40 (60/40) | Wire Solder | 361 ~ 374°F (183 ~ 190°C) | Spool, 17.64 oz (500g) | Leaded | Rosin Activated (RA) | - | - | - | - |
|
BARSN42BI57AG1
SOLDER BAR SN42/BI57/AG1 1LB SUP
|
Liên hệ |
16 - immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
Super Low Dross™ |
Bulk |
Active |
Tài liệu
|
- | - | Bi57Sn42Ag1 (57/42/1) | Bar Solder | 280°F (138°C) | Bar, 1 lb (454g) | Lead Free | - | - | - | - | - |
|
NCSWLF.015 4OZ
LF SOLDER WIRE 96.5/3/0.5 TIN/SI
|
Liên hệ |
15 - immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
CHIPQUIK® |
Bulk |
Active |
Tài liệu
|
0.015" (0.38mm) | - | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Wire Solder | 423 ~ 428°F (217 ~ 220°C) | Spool, 4 oz (113.40g) | - | No-Clean | - | - | - | - |
|
397102
63/37 400 2% .048DIA 16AWG
|
Liên hệ |
2 - immediate |
Harimatec Inc. |
1 |
RoHS non-compliant |
C400 |
Bulk |
Active |
Tài liệu
|
0.048" (1.22mm) | 16 AWG, 18 SWG | Sn63Pb37 (63/37) | Wire Solder | 361°F (183°C) | Spool, 1 lb (454 g) | Leaded | No-Clean | 59°F ~ 86°F (15°C ~ 30°C) | - | - | - |
|
TS391AX250
THERMALLY STABLE SOLDER PASTE NO
|
Liên hệ |
2 - immediate |
Chip Quik Inc. |
1 |
RoHS non-compliant |
- |
Bulk |
Active |
Tài liệu
|
- | - | Sn63Pb37 (63/37) | Solder Paste | 361°F (183°C) | Jar, 8.8 oz (250g) | 4 | Leaded | No-Clean | 68°F ~ 77°F (20°C ~ 25°C) | Date of Manufacture | 12 Months |
|
386818
63/37 HYDRO-X 2% .032DIA 20AWG
|
Liên hệ |
11 - immediate |
Harimatec Inc. |
1 |
RoHS non-compliant |
Hydro-X |
Bulk |
Active |
Tài liệu
|
0.032" (0.81mm) | 20 AWG, 21 SWG | Sn63Pb37 (63/37) | Wire Solder | 361°F (183°C) | Spool, 1 lb (454 g) | Leaded | Water Soluble | 70°F ~ 85°F (20°C ~ 30°C) | - | - | - |
|
SMD4300SNL250T3
SOLDER PASTE SAC305 250G T3
|
Liên hệ |
7 - immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
CHIPQUIK® SMD4300 |
Bulk |
Active |
Tài liệu
|
- | - | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Solder Paste | 423 ~ 428°F (217 ~ 220°C) | Jar, 8.8 oz (250g) | 3 | Lead Free | No-Clean, Water Soluble | 37°F ~ 46°F (3°C ~ 8°C) | Date of Manufacture | 6 Months |
|
T0051388799
WSW SAC L0 SN3,0AG0,5CU3,5%
|
Liên hệ |
9 - immediate |
Apex Tool Group |
1 |
unknown |
Weller® |
Spool |
Active |
Tài liệu
|
0.031" (0.79mm) | - | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Wire Solder | - | Spool, 8.8 oz (250g) | Lead Free | No-Clean | - | - | - | - |
|
SMDSWLF.031 8OZ
LF SOLDER WIRE 96.5/3/0.5 TIN/SI
|
Liên hệ |
18 - immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
- |
Bulk |
Active |
Tài liệu
|
0.031" (0.79mm) | 20 AWG, 22 SWG | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Wire Solder | 423 ~ 428°F (217 ~ 220°C) | Spool, 8 oz (227g), 1/2 lb | Lead Free | No-Clean, Water Soluble | - | - | - | - |
|
RASWLF.031 8OZ
LF SOLDER WIRE 96.5/3/0.5 TIN/SI
|
Liên hệ |
7 - immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
- |
Bulk |
Active |
Tài liệu
|
0.031" (0.79mm) | 21 AWG, 20 SWG | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Wire Solder | 422 ~ 428°F (217 ~ 220°C) | Spool, 8 oz (227g), 1/2 lb | Lead Free | Rosin Activated (RA) | - | - | - | - |
|
SMDSWLF.020 8OZ
LF SOLDER WIRE 96.5/3/0.5 TIN/SI
|
Liên hệ |
3 - immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
- |
Bulk |
Active |
Tài liệu
|
0.020" (0.51mm) | 24 AWG, 25 SWG | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Wire Solder | 423 ~ 428°F (217 ~ 220°C) | Spool, 8 oz (227g), 1/2 lb | Lead Free | No-Clean, Water Soluble | - | - | - | - |
|
SMDSWLF.015 8OZ
LF SOLDER WIRE 96.5/3/0.5 TIN/SI
|
Liên hệ |
15 - immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
- |
Bulk |
Active |
Tài liệu
|
0.015" (0.38mm) | 27 AWG, 28 SWG | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Wire Solder | 423 ~ 428°F (217 ~ 220°C) | Spool, 8 oz (227g), 1/2 lb | Lead Free | No-Clean, Water Soluble | - | - | - | - |
