| Chọn |
Mfr Part # |
Giá |
Stock ? |
Nhà sản xuất |
Số lượng đặt tối thiểu |
RoHS status |
Seri |
Kiểu đóng gói |
Trạng thái sản phẩm |
Tài liệu |
Diameter |
Wire Gauge |
Composition |
Type |
Melting Point |
Form |
Mesh Type |
Process |
Flux Type |
Storage/Refrigeration Temperature |
Shelf Life Start |
Shelf Life |
|
NCSW.031 1LB
SOLDER WIRE 63/37 TIN/LEAD NO-CL
|
Liên hệ |
12 - immediate |
Chip Quik Inc. |
1 |
RoHS non-compliant |
- |
Bulk |
Active |
Tài liệu
|
0.031" (0.79mm) | 20 AWG, 21 SWG | Sn63Pb37 (63/37) | Wire Solder | 361°F (183°C) | Spool, 1 lb (454 g) | Leaded | No-Clean | - | - | - | - |
|
4894-227G
SOLDER RA 60/40 .025" 1/2 LB
|
Liên hệ |
19 - immediate |
MG Chemicals |
1 |
RoHS non-compliant |
4890 |
Spool |
Active |
Tài liệu
|
0.025" (0.64mm) | 22 AWG, 23 SWG | Sn60Pb40 (60/40) | Wire Solder | 361 ~ 376°F (183 ~ 191°C) | Spool, 8 oz (227g), 1/2 lb | Leaded | Rosin Activated (RA) | 50°F ~ 86°F (10°C ~ 30°C) | Date of Manufacture | 60 Months | - |
|
4886-227G
SOLDER RA 63/37 .040" 1/2 LBS
|
Liên hệ |
9 - immediate |
MG Chemicals |
1 |
RoHS non-compliant |
4880 |
Spool |
Active |
Tài liệu
|
0.040" (1.02mm) | 18 AWG, 19 SWG | Sn63Pb37 (63/37) | Wire Solder | 361°F (183°C) | Spool, 8 oz (227g), 1/2 lb | Leaded | Rosin Activated (RA) | 50°F ~ 86°F (10°C ~ 30°C) | Date of Manufacture | 60 Months | - |
|
SMD2016-25000
SOLDER SPHERES SN96.5/AG3.0/CU0.
|
Liên hệ |
14 - immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
SMD2 |
Bulk |
Active |
Tài liệu
|
0.008" (0.20mm) | - | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Solder Sphere | 423 ~ 428°F (217 ~ 220°C) | Jar | Lead Free | - | - | Date of Manufacture | 24 Months | - |
|
SMDSWLF.006 5G
SOLDER WIRE SN96.5/AG3/CU0.5
|
Liên hệ |
8 - immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
- |
Bulk |
Active |
Tài liệu
|
0.006" (0.15mm) | - | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Wire Solder | 423 ~ 428°F (217 ~ 220°C) | Spool, 0.176 oz (5g) | Lead Free | No-Clean, Water Soluble | - | - | - | - |
|
T0051402599
WSW SAC M1 SN3,0AG0,5CU3,5%
|
Liên hệ |
27 - immediate |
Apex Tool Group |
1 |
unknown |
Weller® |
Spool |
Active |
Tài liệu
|
0.031" (0.79mm) | - | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Wire Solder | - | Spool, 3.53 oz (100g) | Lead Free | No-Clean | - | - | - | - |
|
SMDSWLF.031 4OZ
SLD WIRE NO-CLEAN 96.5/3/.5 4OZ.
|
Liên hệ |
26 - immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
- |
Spool |
Active |
Tài liệu
|
0.031" (0.79mm) | 20 AWG, 22 SWG | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Wire Solder | 423 ~ 428°F (217 ~ 220°C) | Spool, 4 oz (113.40g) | Lead Free | No-Clean, Water Soluble | - | - | - | - |
|
SMDSWLF.020 4OZ
SLD WIRE NO-CLEAN 96.5/3/.5 4OZ.
|
Liên hệ |
33 - immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
- |
Spool |
Active |
Tài liệu
|
0.020" (0.51mm) | 24 AWG, 25 SWG | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Wire Solder | 423 ~ 428°F (217 ~ 220°C) | Spool, 4 oz (113.40g) | Lead Free | No-Clean, Water Soluble | - | - | - | - |
|
SMD3SW.020 4OZ
SOLDER WIRE 62/36/2 TIN/LEAD/SIL
|
Liên hệ |
10 - immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
SMD3 |
Bulk |
Active |
Tài liệu
|
0.020" (0.51mm) | - | Sn62Pb36Ag2 (62/36/2) | Wire Solder | 354°F (179°C) | Spool, 4 oz (113.40g) | Leaded | No-Clean, Water Soluble | - | - | - | - |
|
TS391SNL10
THERMALLY STABLE SOLDER PASTE NO
|
Liên hệ |
11 - immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
- |
Bulk |
Active |
Tài liệu
|
- | - | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Solder Paste | 423 ~ 428°F (217 ~ 220°C) | Syringe, 1.23 oz (35g), 10cc | 4 | Lead Free | No-Clean | 68°F ~ 77°F (20°C ~ 25°C) | Date of Manufacture | 12 Months |
|
SMDSWLF.015 4OZ
LF SOLDER WIRE 96.5/3/0.5 TIN/SI
|
Liên hệ |
35 - immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
SMD |
Bulk |
Active |
Tài liệu
|
0.015" (0.38mm) | - | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Wire Solder | 423 ~ 428°F (217 ~ 220°C) | Spool, 4 oz (113.40g) | Lead Free | No-Clean, Water Soluble | - | - | - | - |
|
SSWS-T5-50G
SOLDER PASTE WATER SOLUBLE 63/37
|
Liên hệ |
15 - immediate |
SRA Soldering Products |
1 |
RoHS non-compliant |
- |
Bag |
Active |
Tài liệu
|
- | - | Sn63Pb37 (63/37) | Solder Paste | - | Jar, 1.76 oz (50g) | 5 | - | Rosin Mildly Activated (RMA), Water Soluble | 37°F ~ 42°F (3°C ~ 6°C) | Date of Manufacture | 24 Months |
|
SMD4300SNL10T4
SLDR PST WATR SOL SAC305 T4 10CC
|
Liên hệ |
9 - immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
CHIPQUIK® SMD4300 |
Dispenser |
Active |
Tài liệu
|
- | - | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Solder Paste | 423 ~ 428°F (217 ~ 220°C) | Syringe, 1.23 oz (35g), 10cc | 4 | Lead Free | No-Clean, Water Soluble | 37°F ~ 46°F (3°C ~ 8°C) | Date of Manufacture | 6 Months |
|
T0051388299
WSW SAC M1 SN3,0AG0,5CU3,5%
|
Liên hệ |
19 - immediate |
Apex Tool Group |
1 |
ROHS3 Compliant |
Weller® |
Spool |
Active |
Tài liệu
|
0.020" (0.51mm) | - | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Wire Solder | - | Spool, 3.53 oz (100g) | Lead Free | No-Clean | - | - | - | - |
|
SMDSWLTLFP16
SOLDER WIRE SN42/BI57/AG1 LEAD-F
|
Liên hệ |
14 - immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
CHIPQUIK® |
Bulk |
Active |
Tài liệu
|
- | - | - | - | - | - | - | - | - | - | - | - |
