| Chọn |
Mfr Part # |
Giá |
Stock ? |
Nhà sản xuất |
Số lượng đặt tối thiểu |
RoHS status |
Seri |
Kiểu đóng gói |
Trạng thái sản phẩm |
Tài liệu |
Diameter |
Wire Gauge |
Composition |
Type |
Melting Point |
Form |
Mesh Type |
Process |
Flux Type |
Storage/Refrigeration Temperature |
Shelf Life Start |
Shelf Life |
|
NC2SW.031 1LB
SOLDER WIRE 60/40 TIN/LEAD NO-CL
|
Liên hệ |
36 - immediate |
Chip Quik Inc. |
1 |
RoHS non-compliant |
- |
Bulk |
Active |
Tài liệu
|
- | - | - | - | - | - | - | - | - | - | - | - |
|
SMD2SW.031 1LB
SOLDER WIRE 60/40 TIN/LEAD NO-CL
|
Liên hệ |
9 - immediate |
Chip Quik Inc. |
1 |
RoHS non-compliant |
SMD2 |
Bulk |
Active |
Tài liệu
|
- | - | - | - | - | - | - | - | - | - | - | - |
|
SMD4300SNL10T5
SLD PASTE LF WATER SOL T5 10CC
|
Liên hệ |
7 - immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
CHIPQUIK® SMD4300 |
Dispenser |
Active |
Tài liệu
|
- | - | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Solder Paste | 423 ~ 428u00b0F (217 ~ 220u00b0C) | Syringe, 1.23 oz (35g), 10cc | 5 | Lead Free | No-Clean, Water Soluble | 37u00b0F ~ 46u00b0F (3u00b0C ~ 8u00b0C) | Date of Manufacture | 6 Months |
|
NC2SW.015 8OZ
SOLDER WIRE 60/40 TIN/LEAD (SN60
|
Liên hệ |
10 - immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
CHIPQUIK® |
Bulk |
Active |
Tài liệu
|
- | - | - | - | - | - | - | - | - | - | - | - |
|
BARSN96.5AG3.0CU0.5-8OZ
SOLDER BAR SN96.5/AG3.0/CU0.5 8O
|
Liên hệ |
51 - immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
Super Low Dross™ |
Bulk |
Active |
Tài liệu
|
- | - | Sn96.5Ag3.0Cu0.5 (96.5/3.0/0.5) | Bar Solder | 422 ~ 428u00b0F (217 ~ 220u00b0C) | Bar, 0.5 lb (227g) | Lead Free | - | - | - | - | - |
|
SMD2SWLF.015 8OZ
LF SOLDER WIRE 99.3/0.7 TIN/COPP
|
Liên hệ |
7 - immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
SMD2 |
Bulk |
Active |
Tài liệu
|
- | - | - | - | - | - | - | - | - | - | - | - |
|
WS991AX35T4
THERMALLY STABLE SOLDER PASTE WS
|
Liên hệ |
12 - immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
CHIPQUIK® |
Bulk |
Active |
Tài liệu
|
- | - | Sn63Pb37 (63/37) | Solder Paste | 361u00b0F (183u00b0C) | Syringe, 1.23 oz (34.869g) | 4 | - | Water Soluble | 37u00b0F ~ 77u00b0F (3u00b0C ~ 25u00b0C) | Date of Manufacture | 12 Months |
|
4900P-25G
LEAD FREE NO CLEAN SOLDER PASTE
|
Liên hệ |
77 - immediate |
MG Chemicals |
1 |
ROHS3 Compliant |
4900 |
Bulk |
Active |
Tài liệu
|
- | - | Sn96.2Ag2.8Cu0.4 (96.2/2.8/0.4) | Solder Paste | 423 ~ 430°F (217 ~ 221°C) | Syringe, 0.88 oz (25g) | - | Lead Free | No-Clean | 39°F ~ 50°F (4°C ~ 10°C) | Date of Manufacture | 24 Months |
|
SMDSN90AU10-2FT
SOLDER WIRE (SN90/AU10) TIN/GOLD
|
Liên hệ |
15 - immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
CHIPQUIK® |
Bulk |
Active |
Tài liệu
|
0.016" (0.40mm) | - | Sn90Au10 (90/10) | Wire Solder | 423°F (217°C) | Spool | Lead Free | - | - | Date of Manufacture | 60 Months | - |
|
SMDSWLF.006 10G
SOLDER WIRE SN96.5/AG3/CU0.5
|
Liên hệ |
9 - immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
- |
Bulk |
Active |
Tài liệu
|
0.006" (0.15mm) | - | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Wire Solder | 423 ~ 428°F (217 ~ 220°C) | Spool, 0.35 oz (10g) | Lead Free | No-Clean, Water Soluble | - | - | - | - |
|
NC2SW.020 1LB
SOLDER WIRE 60/40 TIN/LEAD NO-CL
|
Liên hệ |
10 - immediate |
Chip Quik Inc. |
1 |
RoHS non-compliant |
- |
Bulk |
Active |
Tài liệu
|
0.020" (0.51mm) | 24 AWG, 25 SWG | Sn60Pb40 (60/40) | Wire Solder | 361 ~ 370°F (183 ~ 188°C) | Spool, 1 lb (454 g) | Leaded | No-Clean | - | - | - | - |
|
SMD2SW.020 1LB
SOLDER WIRE 60/40 TIN/LEAD NO-CL
|
Liên hệ |
9 - immediate |
Chip Quik Inc. |
1 |
RoHS non-compliant |
SMD2 |
Bulk |
Active |
Tài liệu
|
0.020" (0.51mm) | 24 AWG, 25 SWG | Sn60Pb40 (60/40) | Wire Solder | 361 ~ 370°F (183 ~ 188°C) | Spool, 1 lb (454 g) | Leaded | No-Clean, Water Soluble | - | - | - | - |
|
4865-227G
SOLDER NO-CLEAN 63/37 1/2 LB
|
Liên hệ |
11 - immediate |
MG Chemicals |
1 |
RoHS non-compliant |
4860 |
Spool |
Active |
Tài liệu
|
0.032" (0.81mm) | 20 AWG, 21 SWG | Sn63Pb37 (63/37) | Wire Solder | 361°F (183°C) | Spool, 8 oz (227g), 1/2 lb | Leaded | No-Clean | 50°F ~ 86°F (10°C ~ 30°C) | Date of Manufacture | 60 Months | - |
|
SMDSW.031 1LB
SOLDER WIRE 63/37 TIN/LEAD NO-CL
|
Liên hệ |
16 - immediate |
Chip Quik Inc. |
1 |
RoHS non-compliant |
- |
Bulk |
Active |
Tài liệu
|
0.031" (0.79mm) | 20 AWG, 22 SWG | Sn63Pb37 (63/37) | Wire Solder | 361°F (183°C) | Spool, 1 lb (454 g) | Leaded | No-Clean, Water Soluble | - | - | - | - |
|
RASW.031 1LB
SOLDER WIRE 63/37 TIN/LEAD ROSIN
|
Liên hệ |
13 - immediate |
Chip Quik Inc. |
1 |
RoHS non-compliant |
- |
Bulk |
Active |
Tài liệu
|
0.031" (0.79mm) | 21 AWG, 20 SWG | Sn63Pb37 (63/37) | Wire Solder | 361°F (183°C) | Spool, 1 lb (454 g) | Leaded | Rosin Activated (RA) | Date of Manufacture | 60 Months | - | - |
